IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.
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IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
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Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.
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Developer of Low-Latency Ethernet and Interlaken semiconductor IP solutions for ASIC, ASSP, and FPGA.
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One-source solution for bare die, post-wafer processing, advanced interconnections, component modification, assembly & test services, hi-rel products to Semiconductor & Aero/Defense industries.
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Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
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