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Featured Vendors

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

KARMIC Design Private Ltd is a pioneer and leader in the semiconductor design and development industry. We have expertise in Analog, RF/mmwave, Mixed Signal, Memory ,IO and Digital domains; providing design services and solutions globally. We also provide Embedded/Firmware support and Board testing.

TSMC

Taiwan

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

ASTC is integral to the global embedded electronics supply chain, supplying semiconductors, IP and software, to OEM and systems companies.

SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

AnSem

Belgium

AnSem is a leading fabless analog ASIC Design Service company, offering full turnkey analog, RF and mixed-signal integrated circuits to customers worldwide.

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

LinearASICs brings more than 25 years of experience in providing a full turn-key ASIC design service with extensive expertise in Analog & Mixed-Signal semiconductors.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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