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Featured Vendors

Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

AAI is a leading provider of complete ASIC design (Front End, Back End and Verification) and turnkey manufacturing services for fabless companies and OEM's, which develops advanced SoC devices.

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

HCLTech

Global

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

Provides our customers unsurpassed service in ASIC design services, analog, mixed-signal and RF design, verification, layout, validation, testing, cost reduction, embedded firmware and applications leading to customer success.

Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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