Featured Vendor

Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

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TSMC

Taiwan

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

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RADLogic

Australia

RADLogic provides Mixed Signal IC Design Services, IP Block Development and Sales, and Board, Software and System Application Development.

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

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