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Featured Vendors

RF Semiconductor characterization and training.

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

Xiphera

Finland

Xiphera develops hardware-based cryptographic IP cores, with a portfolio of 30+ solutions delivering high-performance, future-proof security for mission-critical systems.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Allegro DVT

France

Allegro DVT provides Digital Video Compression Solutions, offering Encoder, Decoder, Pixel Processing IPs and industry-standard Compliance Test Suites.

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

ELECTRA IC

TURKIYE

ElectraIC develops ASIC / FPGA, microchip and embedded software/systems, electronic circuit design and verification projects.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

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body{font-family:Arial,Helvetica,sans-serif;color:#222;line-height:1.72;margin:0;background:#fff} article{max-width:980px;margin:0 auto;padding:18px 18px 48px} h1{font-size:38px;line-height:1.18;margin:0 0 20px} h2{font-size:28px;line-height:1.3;margin:36px 0 14px}
Advanced packaging has become the place where AI system performance ...

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