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Advanced ASIC Development, New Product Introduction (NPI) Engineering, High Volume Manufacturing (HVM) Enablement
HBM3 PHY & Controller, Non-Coherent Network-on-Chip (NOC), Coherent Network-on-Chip (NOC), DDR5/4 PHY & Controller, Die-to-Die (D2D) Interconnect, Analog & Configurable I/Os
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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IP Customization—System Design—Consulting
Forward Error Correction, Voice & Data Compression, Security, Telecom DSP, Communication Protocols & Networking, Baseband PHYs
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AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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