IC package
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Services
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Services
SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
IP Cores
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
IP Cores
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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Services
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
IP Cores
Column ADC Patent, Extensive IP Library
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Services
Turnkey ASIC Design and Manufacture
IP Cores
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
IP Cores
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Services
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Services
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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Services
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
IP Cores
RFID analog front-end
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