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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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