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Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation
Power Management, Data Converters, Clock Management, Sensors , Front Ends
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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