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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation
Power Management, Data Converters, Clock Management, Sensors , Front Ends
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Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
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GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
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