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USA
Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.
Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
View vendor pageUSA
Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
View vendor pageChina
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageGermany
As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.
Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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