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USA
Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
View vendor pageChina
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageUK
Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.
Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
View vendor pageIndia
XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.
Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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