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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
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