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USA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageGermany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageIndia
KARMIC Design Private Ltd is a pioneer and leader in the semiconductor design and development industry. We have expertise in Analog, RF/mmwave, Mixed Signal, Memory ,IO and Digital domains; providing design services and solutions globally. We also provide Embedded/Firmware support and Board testing.
PHYSICAL LAYOUT, VERIFICATION, MODELING, PDK DEVELOPMENT, LIBRARY (LAYOUT/ CHAR), EMBEDDED SERVICES
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor pageThe Netherlands
ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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