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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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PHYSICAL LAYOUT, VERIFICATION, MODELING, PDK DEVELOPMENT, LIBRARY (LAYOUT/ CHAR), EMBEDDED SERVICES
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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