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VLC Photonics

Spain

One-Stop development services for Photonic Integrated Circuits.

Services

PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service

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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Microtek

USA

Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.

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SAS Advanced Technologies

Israel

Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.

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