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GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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