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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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