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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Manufacturing Services, Failure Analysis & Characterization, Design Services
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Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening
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Turnkey ASIC / SOC Development, Technology Development Platform, Technology Development Platform, Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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