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UK
EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
View vendor pageUSA
Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.
Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
View vendor pageFinland
CoreHW is your one-stop custom ASIC solution partner. CoreHW can create your exclusive ASIC in a flash with our broad IP portfolio and partner network. CoreHW is ISO9001:2015 certified company.
IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
View vendor pageIndia
Vervesemi is developing high performance Analog IPs and ASICs for sensors and wireless applications, exploiting the expertise of state-of-the-art data converters and differentiated Analog.
GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
View vendor pageUSA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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