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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
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