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Able

Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Services

Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging

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SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

Services

Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services

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Amkor Technology

Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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Aemtec

AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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AnSem

AnSem

Belgium

AnSem is a leading fabless analog ASIC Design Service company, offering full turnkey analog, RF and mixed-signal integrated circuits to customers worldwide.

Services

Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management

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