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Featured Vendors

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

iSine

USA

iSine was founded in 1981 to provide ASIC design, development and manufacturing solutions. Patented LED ballast chips are in production.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

ICsense

Belgium

ICsense offers mixed-signal IC design and ASIC supply services for the automotive/aerospace, industrial, consumer and medical markets. The company is ISO9001:2008 and ISO13485 certified with design HQ in Belgium and sales in Japan, U.S. and Germany.

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

TSMC

Taiwan

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

Chain-IC

The Netherlands

Analog and mixed-signal IC development company based in the Netherlands.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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