IC Package Design

Services

IC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation

IP Cores

SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

Services

Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

Services

RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

Services

Packaging & Assembly

Services

IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services

IP Cores

RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

Services

GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability

Services

Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design

IP Cores

Column ADC Patent, Extensive IP Library

Services

Test and Qualification, OSAT, Component Modification, Supply Chain Services, Advanced Packaging, Wafer Processing

Services

Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics

IP Cores

Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

Services

Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design

IP Cores

Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References

Services

Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design

IP Cores

RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design