50 results found
The Netherlands
NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.
Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record
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USA
ASIC, FPGA, and custom IC development services including front and back-end design, IP development, package design, manufacturing, assembly, and test.
USA
SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.
SEMPAC Open-Pak™ Products
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France
Secure-IC develops trusted computing security technologies for embedded systems to protect them from malevolent attacks and cyber threats.
China
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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