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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
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AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
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