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Featured Vendors

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

XQWave

India

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

TSMC

Taiwan

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

CSEM

Switzerland

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

Provides our customers unsurpassed service in ASIC design services, analog, mixed-signal and RF design, verification, layout, validation, testing, cost reduction, embedded firmware and applications leading to customer success.

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

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