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Featured Vendors

GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

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Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

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ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

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Kamaten Technology

Canada

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

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Rochester Electronics

USA

Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.

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Tessolve Semiconductor

USA

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

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Chiplet Summit 2025



January 21, 2025 – January 23, 2025
Why should we go
UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough
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12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS)
Apple’s First AI Server Chip to be Engineered in Israel
Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence
MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have
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[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology,

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