June 20, 2018, anysilicon
T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the
June 06, 2018, anysilicon
Dolphin Integration announces the availability in free download of its innovative IDE SmartVisionTM supporting the RISC-V Instruction Set Architecture (ISA).
A suitable software development environment is fundamental for optimizing designs in terms of power consumption, area (code density) and performances. Thanks to its IDE, Dolphin integration enables early in
May 28, 2018, anysilicon
Andes Technology Corporation, the leading Asia-based suppliers of small, low-power, high performance 32-bit embedded CPU cores, and XtremeEDA Corporation, a leading North American provider of front-end design and verification services for the semiconductor industry, today announced they will cooperate to develop joint design wins to benefit both companies. Andes will
Read MoreMay 28, 2018, anysilicon
Semiconductor intellectual property provider CAST, Inc. has seen a significant upswing in licenses for the venerable 8051 microcontroller, as today’s designers rediscover that the simplicity, low-power operation, small silicon area, and relatively inexpensive cost of this 8-bit MCU are an excellent match for the demands of many modern products. Specifically,
Read MoreMay 24, 2018, anysilicon
Chipus has been developing battery charger circuits since 2012 and the new IP generation reuses the proven experience of the existing designs with enhanced capabilities.
First generation of battery charger family IP was silicon proven in 2013 in SilTerra 0.18um CMOS and it is capable of dealing with 1.5A
May 16, 2018, anysilicon
T2M, the world’s largest independent global semiconductor technology provider today announced that, Mindtree, will be showcasing their customer proven BQB-qualified Bluetooth Mesh v1.0 software and Bluetooth Low Energy 5.0 Modem, Digital Link Layer, Protocol Stack SW and Profiles IP at Bluetooth Asia 2018 on 30, 31 May at Shenzhen Convention
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