Category Archives: IP Cores

Faraday Announces LPDDR4/4X in Samsung 14LPC Process

araday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its LPDDR4 and LPDDR4X combo PHY IP up to 4.2Gbps is now available in Samsung’s 14nm LPC process. The silicon proven solution provides smaller area, lower power, and high bandwidth for applications such as multi-media,

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Silicon IP Provider Chips&Media Launches AV1 Video Encoder Hardware IP for 4K/UHD Video Resolutions and Beyond

Seoul, South Korea – June 17th, 2021 – Chips&Media, a worldwide leading hardware IP provider of video codec, computer vision, and image signal processing, today unveiled AV1 supported video encoder hardware IP WAVE627, from the newly released next-generation video codec IP platform, WAVE6.
The WAVE6 series is a newly designed

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Cortus Develops Next Generation High-End RISC-V CPU Core for HPC

Mauguio, France – June, 14th 2021: Cortus S.A.S., a leader in custom Systems-on-Chip (SoC) design services and integrated circuit (IC) provider, today announced that it is developing the high-performance Out-of-Order (OoO) processor core which is at the heart of the European eProcessor project. This project is lead by the Barcelona

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RISC-V Functional Safety Processor IP Core Introduced by CAST and Fraunhofer IPMS

press release

Woodcliff Lake, New Jersey — May 24, 2021 — Semiconductor intellectual property provider CAST, Inc. today announced the immediate availability of EMSA5-FS, a fault-tolerant embedded RISC-V processor IP core designed to meet the most stringent functional safety requirements of automotive, airborne, and other safety-critical applications.
Developed by Fraunhofer IPMS,

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The CXL Arbitrator & Multiplexer in a Nutshell

CXL is an aspiring new technology for high bandwidth devices like Accelerators, GPUs etc. In an era where there is growing need of High-Performance Computing (HPC), CXL offers high bandwidth and a low latency connectivity between Host (typically a CPU) and Devices like accelerators, memory expansion devices etc.

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Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor

Seoul, South Korea – May 20th, 2021 – Chips&Media announced today the participation as an exhibitor at the 2021 Embedded Vision Summit, the premier event for innovators adding computer vision and AI to products from May 25th to 28th.
Chips&Media will introduce a more advanced and intellectual super-resolution with the

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