Category Archives: IP Cores

Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology

Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced the availability of its well-established sensing fabric on TSMC’s industry-leading N6 process technology.
 
TSMC N6 process provides significant power and performance enhancements of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage for a broad

CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems

Woodcliff Lake, NJ — August 6, 2020 — Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.
 
The new core variant was developed

Talking Sense with Moortec… Staying on the right side in worst case conditions – Power (Part 1)

In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
 
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process

Phison appoints T2M-IP for global marketing, representation, and business development

Phison, the market leader in NAND Flash controllers chips and IPs for SSD, PCIe, SD, eMMC, ONFi, UFS & USB Consumer, Embedded & Enterprise applications has signed an agreement with T2M-IP, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of

CEO Talk: Koen Verhaege, Sofics

This interview was held with Koen Verhaege, CEO of Sofics.
 

 
Tell me a bit about your background? How did you first get started with your company?
I graduated from the University of Leuven, Belgium, with a degree in microelectronics in 1990 and started my professional career at

Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process

Plymouth, UK, 10th June 2020
 
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s  highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy