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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Fraunhofer Institute for Integrated Circuits IIS

Germany

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

Services

Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems

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Microtek

USA

Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.

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SAS Advanced Technologies

Israel

Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.

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Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Services

Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging

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