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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Turnkey ASIC – Full-Cycle Silicon Development, RTL Design & Verification, Analog Mixed-Signal Design and Layout, Synthesis, DFT & Physical Design, Post-Silicon Validation, IP Services, Product Engineering Services
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