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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
View vendor pageCanada
CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.
Fabrication Services, CAD Services, R&D Services
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageUSA
iSine was founded in 1981 to provide ASIC design, development and manufacturing solutions. Patented LED ballast chips are in production.
Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
Analog IP Cores, Digital IP Cores
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