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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management
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ASIC design, ASIC verification, System validation and industrialization , Full turnkey
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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