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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
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AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
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Design Execution, AMS Circuit Design, Reliability & Product Engineering, Embedded Software, Low-Cost ASIC
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