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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management
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ASIC Turnkey Service / ASIC Prototyping Service, IC Design Services, Power Semiconductor Turnkey Service
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IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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