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Amkor Technology

Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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Rood Microtec logo

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Services

Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services

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ekss Microelectonics LTD

E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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racyics

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

Services

Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform

IP Cores

0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)

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