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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Smart Integrated Power, Wireless Communications, RF-Energy, Characterization and Testing, EDA, Consultancy and Training Services, Supply Chain Management, Certifications
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Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
CPU & SoC, Security, General Purpose IP, Analog IP
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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