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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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IC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation
SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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