Semiconductor Packaging

The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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OpenFive

USA

OpenFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, OpenFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP

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ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Services

Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design

IP Cores

RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

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ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Services

Assembly, Test Service, ASE Turnkey Services

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SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

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PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

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PREMA Semiconductor

Germany

PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.

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HANA Micron

Korea

Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.

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Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

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Linwave Technology

UK

Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.

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PandA Europe

UK

PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.

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TAIPRO Engineering

Belgium

TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.

Services

Packaging services, Process/Product industrialization, Full Project Development

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MAK

Sweden

MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.

Services

Microelectronic Assembly, Encapsulation and potting, Engineering Services

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Milandr

Russia

A reliable analog and mixed-signal semiconductor solution source.

Services

Analog IP design , Mixed-signal design , Digital IP design, RF design, ASIC design

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Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

Services

Test Sockets, Pogo Pins, Custom Connectors

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