The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services
RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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