Semiconductor Packaging
The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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USA
asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.
Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageSweden
Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.
Services
ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
IP Cores
RF, Analog, Power, Digital
View vendor pageUSA
Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.
Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
View vendor pageUSA
Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.
Services
Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
IP Cores
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
View vendor pageUSA
“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.
Services
SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
IP Cores
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
View vendor pageUK
We partner companies, start-ups and academia to design and develop innovative, leading-edge ASIC solutions across multi-domain applications.
Services
Chip Design and Development, Implementation, Turnkey solutions, Speciality Services
IP Cores
12 bit SAR ADC, Digital temperature sensor
View vendor pageBelgium
Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.
More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.
Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
View vendor pageChina
Brite Semiconductor is a world-leading ASIC design solution provider, targeting ULSI ASIC/SoC chip design on SMIC advanced 55nm/40nm/28nm/14nm process technology and turn-key solutions.
Services
ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor pageUSA
Cactus Semiconductor is a full-service provider of low-power mixed-signal ASICs specializing in miniaturized portable and implantable medical devices.
Services
Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
View vendor pageUSA
Turnkey analog/mixed-signal ASIC solutions (design & manufacture). Agile IC tech to get your IC to profits quickly.
Services
Turnkey ASIC Design and Manufacture
IP Cores
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include +8M ft2 of volume production, development, sales & support.
Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageUSA
MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.
Services
RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
IP Cores
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
View vendor pageFrance
HCM.SYSTREL is a semiconductor assembly and test house (back-end services).
Services
Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
View vendor pageSingapore
Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.
Services
Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageSweden
MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.
Services
Microelectronic Assembly, Encapsulation and potting, Engineering Services
View vendor pageUSA
Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
Services
QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
View vendor pageUSA
SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.
Services
Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
View vendor page 
