Semiconductor Packaging
The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Germany
iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.
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Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.
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BlackPepper Technologies provides High-end value added technology services offering Spec to Silicon, Silicon to System Design, differentiated product & engineering capabilities for global semiconductor companies
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ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.
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WiWoTech is a design and development company focused in IC package, silicon validation, wireless system and Smart Antenna design
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China
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Services
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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USA
MegaChips provides high performance high quality ASICs in advanced geometries for 5G macro/small cells and repeater, ultra-low power wireless communications, wired/optical communications, image signal processing and nanopore.
Services
RTL Design, FPGA to ASIC conversion, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
IP Cores
High-speed ADC/DAC, Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, DisplayPort & HDMI, Processor
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USA
Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
Services
QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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USA
One-source solution for bare die, post-wafer processing, advanced interconnections, component modification, assembly & test services, hi-rel products to Semiconductor & Aero/Defense industries.
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USA
ASIC, FPGA, and custom IC development services including front and back-end design, IP development, package design, manufacturing, assembly, and test.
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USA
Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.
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The Netherlands
NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.
Services
Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record
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France
French semiconductor company specializing in the design and supply of exclusive and custom-made integrated circuit (ASIC & SoC) solutions.
Services
Turnkey ASIC Design & Supply, IC Design Services, Supply Chain Management, ASIC Industrialization, Design and Implementation Expertise
IP Cores
ASIC Reference Designs , Analog, Encryption and authentication , Digital
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USA
Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.
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india
A leading silicon-proven IP and ASIC Solutions provider for Advanced Process Technologies along with Embedded Software & System-Level Solutions.
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Germany
TES Electronic Solutions is a leading full-spectrum global Electronics Design Services Company with headquarter in Germany.
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Located in Silicon Valley, for the past 29 years, Spectrum Semiconductor Materials, Inc. is a World-Wide Authorized Distributor of packages and lids for IC assembly.
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TICP provides turnkey solution for Memory, Analog and mixed IC.
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Teledyne e2v is an expert in advanced semiconductors assembly and test capabilities which meet very demanding market needs such as Avionics, Aerospace and Space.
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USA
SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.
Services
Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
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