Find within All Vendors and Blog Pages:

or contact us, we will find a vendor that matches you needs

Find ASIC Design, Layout and Verification Vendors

or contact us, we will find a vendor that matches you needs

Find IP Cores

or contact us, we will find a vendor that matches you needs

Find IP Cores

or contact us, we will find a vendor that matches you needs

Find MPW, Mask-Set and Wafer Vendors:

or contact us, we will find a vendor that matches you needs

Find IC Package, Assembly and Substrate Vendors:

or contact us, we will find a vendor that matches you needs

Find IC Testing, LoadBoard and ProbeCard Vendors:

or contact us, we will find a vendor that matches you needs

Find Qualification and Failure Analysis Vendors:

or contact us, we will find a vendor that matches you needs

Get Prices from Vendors within 24 Hours

Go

or contact us, we will find a vendor that matches you needs

Featured Vendors

NTLab

Lithuania

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

Get the Best Price Quotes for Your Needs

Contact Us Today

Latest News Read More »

Semiconductor News Read More »

Jan. 23, 2026, –  Enabling low-cost, low-latency chiplet connectivity for Physical AI at ...
January 21st, 2026: ICsense, a TDK Group company and leading fab-independent European ...
TES Electronic Solutions GmbH adds to its IP portfolio a new VHDL-based ...
AnySilicon helps you connect with experienced sales agents, reps, and local partners ...
This interview features Howard Pakosh,  CEO & Founder at The TekStart Group.
Discover how ams OSRAM’s ASIC customization, in-silicon innovation, and advanced packaging deliver ...
28nm is a turning point in ASIC development. It is often described as ...
40nm is often the first node where advanced-node realities become unavoidable. While still ...

Get the Best Price Quotes for Your Needs

Contact Us Today

Tools

Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.