HDL Design House Selected as ARM Approved Design Partner

December 20, 2016, anysilicon


Belgrade, Serbia – December 20th, 2016 – HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies

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300mm Silicon Wafers Market Overview

December 19, 2016, anysilicon


Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers.  Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown

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Embedded die: from Incubation to High Volume Production

December 16, 2016, anysilicon


Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC[1] package substrate came from DC/DC[2] converters in smartphones, penetration in other market segments of interest to embedded

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Samsung Likely to Spin off Foundry Business Division

December 15, 2016, anysilicon

According to Business Korea Samsung Electronics is considering a reorganization of the System LSI division in order to systematically grow the system semiconductor business. The company is planning to separate the design and manufacturing sectors in the business unit and divide or spin off it to fabless and foundry business

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ELSYS America Celebrates its 1-Year Anniversary

December 15, 2016, anysilicon


SANTA CLARA, DECEMBER 15th 2016 – ELSYS America celebrates its 1st anniversary in the Silicon Valley. ELSYS America is built upon its mother company’s, ELSYS Design, 15+ years experience in integrated circuit design, partnering with all the major semiconductors companies based in Europe; it has successfully extended this offer to

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CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors

December 13, 2016, anysilicon


MOUNTAIN VIEW, Calif., Dec. 12, 2016 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Maria Marced, President of TSMC Europe BV., has been appointed to its board of directors, as an independent non-executive director, effective December 8, 2016.

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