Blog

Understanding Wafer Bumping Packaging Technology

June 09, 2018, anysilicon

wafer bumping feature

Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the

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MEMS market will experience a 17.5% growth in value between 2018 and 2023

June 06, 2018, anysilicon

yole_developpement_logo

“MEMS[1] market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period,” asserts Dr. Eric Mounier, Principal Analyst, MEMS & Photonics, at Yole Développement (Yole).“The consumer market segment is showing the biggest share, with more than 50%[2]. The good news is that

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Dolphin Integration makes its innovative IDE SmartVision, free for download for the RISC-V ecosystem

June 06, 2018, anysilicon

risc-v

Dolphin Integration announces the availability in free download of its innovative IDE SmartVisionTM supporting the RISC-V Instruction Set Architecture (ISA).
 
A suitable software development environment is fundamental for optimizing designs in terms of power consumption, area (code density) and performances. Thanks to its IDE, Dolphin integration enables early in

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IMI global and Beckermus Cooperation

June 06, 2018, anysilicon

parternship

We are happy to announce that Beckermus and IMI has signed a strategic cooperation agreement. The cooperation goals are focused on enhancing each party advantages and facilities to support clients’ needs.
 
In a nutshell, Beckermus will supply Integrated Micro-Electronics Inc. (IMI) with prototype assembly services for microelectronics, micro-optics, photonics and electro-optics and

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Sankalp Semiconductor to Exhibit at Design Automation Conference – 2018

June 05, 2018, anysilicon

DAC

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at DAC from 25-27th June in Moscone, San Francisco. Sankalp offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom layout, standard cell development,

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Who’s Managing Your IC Power Management?

June 05, 2018, anysilicon

feature bob

Today’s complex systems employ a wide variety of semiconductor technologies. From the deepest sub nanometer processors to the Analog I/O, it’s easy to see the need for power management devices for 1.0V, 1.2V, 1.5V, 1.8V, 2.2V, 2.5V, 2.8V, 3.0V, 3.3V and more, all in the same box.
 
Dozens of

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