Presto Engineering Launches New Image Sensor Turnkey Services

June 16, 2017, anysilicon


Presto Engineering Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, now offers a turnkey industrialization service for image sensors. The industry has experienced an increase in demand for these sensors, which are often used in devices that connect to the internet (IoT).

Read More

7 of the Top 10 Smartphone Suppliers Headquartered in China

June 15, 2017, anysilicon


IC Insights recently released its Update to its 2017 IC Market Drivers Report.  The Update includes IC Insights’ latest outlooks on the smartphone, automotive, PC/tablet and Internet of Things markets.
The Update shows a final 2016 ranking of the top smartphone leaders in terms of unit shipments.  As shown in

Read More

Silab Tech Announces Release of XGS-PON SERDES IP Core

June 13, 2017, anysilicon

serdes silab tech

Silab Tech, a leading supplier of high speed serial interface intellectual property designs (IP cores) announced today the release of its XGS-PON PHY. This IP Core provides symmetrical 10Gbps interconnect solution for Next Generation Passive Optical Networks (PON). The IP Core is silicon proven on 40nm node and was integrated

Read More

Open-Silicon Unveils Industry’s Highest Performance Interlaken Chip-to-Chip Interface IP

June 12, 2017, anysilicon


Open-Silicon, a system-optimized ASIC solution provider and founding member company of the Interlaken Alliance, today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is

Read More

Faraday Announces the World’s First Automotive ASIC Qualified for AEC-Q100 and AEC-Q006

June 12, 2017, anysilicon


Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced today that it has completed the first-ever automotive ASIC device qualified for AEC-Q100 and AEC-Q006 as defined by the Automotive Electronics Council (AEC). This milestone achievement demonstrates Faraday’s readiness to participate in this quality-driven marketplace bringing

Read More

ELSYS Eastern Europe Selected As ARM Approved Design Partner

June 07, 2017, anysilicon

ARM_design partner

ELSYS Eastern Europe, the subsidiary of ELSYS Design, has joined the ARM® Approved Design Partner Program. Design partners selected for the program help enable ARM silicon partners with design support and training services to successfully deliver ARM-based SoCs optimized for targeted market opportunities.
To receive ARM Approved Design Partner

Read More