Blog

Tiannengbo optimises their latest Mining Chip using Moortec’s Embedded Temperature Sensor

September 04, 2018, anysilicon

moortec

Moortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.
 
As a company Tiannengbo’s main focus is on chip and system design, production and sales. The company also

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NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks

September 04, 2018, anysilicon

acquisition

NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest supplier of automotive semiconductors1, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving. OmniPHY’s advanced high-speed technology, combined with NXP’s leading portfolio and

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Choose Through Silicon Via (TSV) Packaging for Improved Performance

September 03, 2018, anysilicon

amkor1

A smaller form-factor with higher data transfer rate, signal integrity, memory bandwidth, and thermal capability are all criteria for improving system performance. Today’s highly integrated and portable products strive to improve all of these metrics. Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory

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Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC China 2018

August 31, 2018, anysilicon

news

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting and presenting at D&R IP-SoC Day on 13th September in Shanghai, China. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom

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Memory ICs to Account for 53% of Total 2018 Semiconductor Capex

August 28, 2018, anysilicon

View of a Businessman in front of a wall with a Processor chip and network connection - 3d render

IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year.  The $102.0 billion spending level represents a 9% increase over $93.3 billion spent in 2017, which was a

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GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings

August 28, 2018, anysilicon

globalfoundries_feat

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients

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