The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics
Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions
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IC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation
SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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RTL Design and Verification, Design Verification, Design For Test, Physical Design, Static Timing Analysis, Post Silicon Validation
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Test and Qualification, OSAT, Component Modification, Supply Chain Services, Advanced Packaging, Wafer Processing
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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