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Featured Vendors

Noesis Technologies

Greece

Noesis Technologies is a Silicon IP provider specialized in hardware implementation of complex telecom algorithms for wireless and wireline applications.

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SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

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AnalogueSmith

Singapore

We provide RFIC, analogue, and mixed signal ASIC design services focused on IoT sensor node design and other markets.

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RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

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ICleviathan

Israel

ICleviathan is an multi national IC supply chain company. Established in 2005. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. Our customer base includes, start-ups, system companies and Defence companies.

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Building a Fabless Semiconductor Business:
In the fast-evolving landscape of semiconductor technology, the term “fabless semiconductor companies”
Chiplet Summit 2025



January 21, 2025 – January 23, 2025
Why should we go
UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough
Cadence Appoints Moshe Gavrielov to Board of Directors
12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS)
Apple’s First AI Server Chip to be Engineered in Israel
Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence
MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have
Chiplet Market set to Reach $411 Billion by 2035
[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology,

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