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Choosing, Integrating and Managing Chiplets

Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or "chiplets." These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex ...

Faraday Unveils ASIC Success in Factory Automation

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance ...

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

BCD, CMOS, FinFET, SOI, GaN & SiC Technologies Explained

Introduction to Semiconductor Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors. Doping ...

Advanced Circuit Engineers

USA

ACE provides high quality advanced level FIB circuit editing, Dual-Beam imaging and atomic resolution TEM analytical services.

Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA

Kaiserslautern, Germany – May 21, 2025 – Creonic GmbH, a leading provider of ready-to-use IP cores for ASIC and FPGA applications, announces the release of its new oFEC (Open Forward Error Correction) codec IP core. The solution supports next-generation optical and high-speed communication systems and is now available in both ...

ficonTEC and PHIX partner to enable high-volume manufacturing of multi-chip photonic modules

PHIX B.V. of Enschede, The Netherlands, is a Dutch packaging foundry that assembles their customers’ photonic integrated circuits into complete modules. As these modules evolve from initial prototypes into mature products, the manufacturing volumes become much larger and a higher level of automation is required. This aspect of photonic device ...

IC Failure Analysis Lab

USA

IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.

Creonic’s DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard

Creonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies.   The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based data delivery.  With ...

Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production

Hsinchu, Taiwan -- July 11, 2023 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, launched its SerDes (serializer/deserializer) total solution comprises SerDes IP design on UMC 28nm and the corresponding IP advanced (IPA) service which includes IP subsystem integration, PHY hardcore implementation, and signal integrity/power ...