Find companies providing IC FIB Services

FIB Circuit Edit

What is a Circuit Edit?   A circuit edit is when you need to modify an existing ASIC or integrated circuit for whatever reason. This is usually done with the help of an ion beam that is focused onto the chip to modify it as per the request of the designer. Engineers ...

BCD, CMOS, FinFET, SOI, GaN & SiC Technologies Explained

Introduction to Semiconductor Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors. Doping ...

Transmission Electron Microscopy (TEM) for Semiconductor Failure Analysis

Transmission Electron Microscopy (TEM) is one of the highest-resolution physical-analysis techniques used in semiconductor failure analysis. It allows failure analysts to examine extremely small structural and material anomalies that may be impossible to characterize using optical microscopy or conventional SEM alone. TEM works by transmitting a high-energy electron beam through an ...

X-Ray Inspection for Semiconductor Package Failure Analysis

Many important semiconductor package defects are completely hidden from optical inspection. A solder ball can contain a void. A bond wire can be broken inside an encapsulated package. A die-attach layer may contain large areas of voiding. A package substrate can contain an open trace, and an advanced package may have ...

IC Decapsulation: Methods, Process and Applications

Many semiconductor failure-analysis techniques require direct access to structures that are hidden inside an IC package. The semiconductor die, bond pads, bond wires and other critical components may be completely covered by epoxy molding compound or other packaging materials. Before these structures can be examined using techniques such as optical microscopy, emission ...

Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

China Imposes Export Restrictions on Key Minerals to the United States

The Chinese Ministry of Commerce today announced immediate export restrictions on gallium, germanium, antimony, and super-hard materials to the United States. This action cites national security concerns and represents a significant escalation of trade tensions between the two countries. The restrictions follow recent U.S. actions to curb exports of semiconductor-related ...

Understanding Silicon Photonics Market, Technology and Applications

With a rapid progression in the applications involving artificial intelligence, data generation has been increased exponentially in last few years. It has been estimated that in 2018, 2,5 quintillion bytes of data is generated every day [1]. This huge data generation puts enormous computational requirements on telecom platforms and  data ...

Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Palo Alto, CA - 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform ...

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.