Find companies providing IC FIB Services

Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Palo Alto, CA - 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform ...

Scanning Acoustic Microscopy (SAM) for Semiconductor Failure Analysis

Scanning Acoustic Microscopy (SAM) is a non-destructive imaging technique widely used in semiconductor failure analysis to inspect structures and interfaces hidden inside IC packages. Unlike optical microscopy, which relies on visible light, or X-ray inspection, which relies primarily on differences in material density and X-ray absorption, SAM uses high-frequency acoustic waves. This ...

Gallium Arsenide (GaAs) Overview

Gallium arsenide (GaAs) technology is a type of semiconductor material used in the manufacturing of various electronic devices. It is known for its high electron mobility, which allows it to operate at higher speeds and with lower power consumption compared to other semiconductor materials such as silicon. GaAs technology is ...

Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA

Kaiserslautern, Germany – May 21, 2025 – Creonic GmbH, a leading provider of ready-to-use IP cores for ASIC and FPGA applications, announces the release of its new oFEC (Open Forward Error Correction) codec IP core. The solution supports next-generation optical and high-speed communication systems and is now available in both ...

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Introduction to Silicon-Germanium (SiGe) Technology

Overview of Silicon-Germanium (SiGe) Technology and Historical Development   Shockley's early transistor game most likely inspired the notion of fusing silicon (Si) and germanium (Ge) to create an alloy for use in transistor engineering. However, this concept has just become a reality in the last 15 years due to the challenges associated ...

Xscape Photonics Secures $44 Million in Series A Funding to Revolutionize Data Center Connectivity

October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair ...

Physical Failure Analysis (PFA) of Semiconductor Devices

Once an electrical failure has been localized inside an integrated circuit, the next challenge is determining what physically went wrong.  Was a metal interconnect broken?  Did a via fail?  Is there contamination between two structures? Has a dielectric layer broken down? Is a transistor structure abnormal? Or did the failure originate in the ...

Faraday Unveils ASIC Success in Factory Automation

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance ...

Electrical Failure Analysis (EFA) of Integrated Circuits

When an integrated circuit fails, one of the first questions is: How is the device failing electrically?   A chip may exhibit excessive leakage current, a short circuit, an open connection, abnormal supply current, a parametric shift or a complete functional failure. Before engineers physically cut into the device, they usually want to ...