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PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

IC Decapsulation: Methods, Process and Applications

Many semiconductor failure-analysis techniques require direct access to structures that are hidden inside an IC package. The semiconductor die, bond pads, bond wires and other critical components may be completely covered by epoxy molding compound or other packaging materials. Before these structures can be examined using techniques such as optical microscopy, emission ...

X-Ray Inspection for Semiconductor Package Failure Analysis

Many important semiconductor package defects are completely hidden from optical inspection. A solder ball can contain a void. A bond wire can be broken inside an encapsulated package. A die-attach layer may contain large areas of voiding. A package substrate can contain an open trace, and an advanced package may have ...

Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

IC Short Circuit Failure Analysis | Locate Semiconductor Shorts

IC short circuit failure analysis is the process of determining where an unintended electrical connection exists inside a semiconductor device, package or interconnect structure and identifying the physical defect that created the short. A short circuit may initially appear only as excessive supply current, unexpectedly low resistance between two nodes, abnormal ...

Semiconductor Failure Analysis: The Complete Guide to IC Failure Analysis

Semiconductor devices can fail for many reasons: manufacturing defects, electrical overstress, electrostatic discharge, contamination, packaging problems, excessive temperature, mechanical stress, aging or defects introduced during assembly.   Finding the actual cause of an IC failure, however, is rarely as simple as looking at the damaged device.   Semiconductor failure analysis (FA) is the systematic ...

Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA

Kaiserslautern, Germany – May 21, 2025 – Creonic GmbH, a leading provider of ready-to-use IP cores for ASIC and FPGA applications, announces the release of its new oFEC (Open Forward Error Correction) codec IP core. The solution supports next-generation optical and high-speed communication systems and is now available in both ...

Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC’s 22nm Platform

Hsinchu, Taiwan -- June 24, 2025 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm process technology. Designed to meet the increasing demands of high-speed data transmission, the new SerDes IP supports a broad ...

BCD, CMOS, FinFET, SOI, GaN & SiC Technologies Explained

Introduction to Semiconductor Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors. Doping ...

Xscape Photonics Secures $44 Million in Series A Funding to Revolutionize Data Center Connectivity

October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair ...