Find companies providing IC FIB Services

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Transmission Electron Microscopy (TEM) for Semiconductor Failure Analysis

Transmission Electron Microscopy (TEM) is one of the highest-resolution physical-analysis techniques used in semiconductor failure analysis. It allows failure analysts to examine extremely small structural and material anomalies that may be impossible to characterize using optical microscopy or conventional SEM alone. TEM works by transmitting a high-energy electron beam through an ...

IC Failure Analysis Techniques: A Complete Guide

When an integrated circuit fails, identifying the damaged component is only part of the challenge. Engineers must determine where the failure occurred, what physical or electrical mechanism caused it, and ultimately why it happened. This requires a combination of specialized IC failure analysis techniques. Some techniques detect electrical abnormalities without physically altering ...

Faraday Unveils ASIC Success in Factory Automation

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance ...

Electrical Failure Analysis (EFA) of Integrated Circuits

When an integrated circuit fails, one of the first questions is: How is the device failing electrically?   A chip may exhibit excessive leakage current, a short circuit, an open connection, abnormal supply current, a parametric shift or a complete functional failure. Before engineers physically cut into the device, they usually want to ...

Semiconductor Failure Analysis: The Complete Guide to IC Failure Analysis

Semiconductor devices can fail for many reasons: manufacturing defects, electrical overstress, electrostatic discharge, contamination, packaging problems, excessive temperature, mechanical stress, aging or defects introduced during assembly.   Finding the actual cause of an IC failure, however, is rarely as simple as looking at the damaged device.   Semiconductor failure analysis (FA) is the systematic ...

FIB Circuit Edit

What is a Circuit Edit?   A circuit edit is when you need to modify an existing ASIC or integrated circuit for whatever reason. This is usually done with the help of an ion beam that is focused onto the chip to modify it as per the request of the designer. Engineers ...

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Introduction to Silicon-Germanium (SiGe) Technology

Overview of Silicon-Germanium (SiGe) Technology and Historical Development   Shockley's early transistor game most likely inspired the notion of fusing silicon (Si) and germanium (Ge) to create an alloy for use in transistor engineering. However, this concept has just become a reality in the last 15 years due to the challenges associated ...

Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production

Hsinchu, Taiwan -- July 11, 2023 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, launched its SerDes (serializer/deserializer) total solution comprises SerDes IP design on UMC 28nm and the corresponding IP advanced (IPA) service which includes IP subsystem integration, PHY hardcore implementation, and signal integrity/power ...