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The Ultimate Guide to: BiCMOS

The semiconductor industry went through several stages of evolution, beginning with the Metal Oxide Semiconductor (MOS) Field-Effect Transistor (FET) which was first proposed by Lilienfeld and Heil in the 1930s, moving on to bipolar in the 1950s and N-channel metal-oxide semiconductor (NMOS) in 1970s, and ultimately becoming the standard in ...

Nanoprobing for Semiconductor Failure Analysis

Nanoprobing is an advanced electrical characterization and fault-localization technique used in semiconductor failure analysis to directly investigate individual transistors, contacts, vias and interconnect structures inside an integrated circuit. Instead of relying only on package-level electrical measurements, nanoprobing allows extremely small conductive structures on a deprocessed semiconductor die to be contacted using ...

IC Decapsulation: Methods, Process and Applications

Many semiconductor failure-analysis techniques require direct access to structures that are hidden inside an IC package. The semiconductor die, bond pads, bond wires and other critical components may be completely covered by epoxy molding compound or other packaging materials. Before these structures can be examined using techniques such as optical microscopy, emission ...

Semiconductor Failure Analysis Services | Find an IC Failure Analysis Lab

Need semiconductor failure analysis services? AnySilicon helps semiconductor companies, fabless companies, IDMs, electronics manufacturers and engineering teams identify failure analysis laboratories with the equipment and expertise required to investigate IC, wafer, die and semiconductor package failures. A good semiconductor failure analysis lab does more than operate laboratory equipment. The laboratory must ...

Electrical Failure Analysis (EFA) of Integrated Circuits

When an integrated circuit fails, one of the first questions is: How is the device failing electrically?   A chip may exhibit excessive leakage current, a short circuit, an open connection, abnormal supply current, a parametric shift or a complete functional failure. Before engineers physically cut into the device, they usually want to ...

ASIC Design for Silicon Photonics

Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.   This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower power consumption ...

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Package Failure Analysis Services | IC Package FA Lab

Package failure analysis is the systematic investigation of defects and failures originating within semiconductor packaging, interconnects, solder connections, die attach, bond wires, redistribution layers and other structures that connect the semiconductor die to the outside system. A semiconductor device may fail electrical testing even though the silicon itself is functioning correctly. ...

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

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