The richest directory of IC Package worldwide. Find the IC Package that matches your needs.
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UK
Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.
UK
PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.
Belgium
TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.
Packaging services, Process/Product industrialization, Full Project Development
View vendor pageSweden
MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.
Microelectronic Assembly, Encapsulation and potting, Engineering Services
View vendor pageUSA
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Test Sockets, Pogo Pins, Custom Connectors
View vendor pageGermany
iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.
Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.
ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.
WiWoTech is a design and development company focused in IC package, silicon validation, wireless system and Smart Antenna design
China
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
View vendor pageUSA
Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
View vendor pageUSA
One-source solution for bare die, post-wafer processing, advanced interconnections, component modification, assembly & test services, hi-rel products to Semiconductor & Aero/Defense industries.
USA
Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.
Israel
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageThe Netherlands
NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.
Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record
View vendor pageUSA
Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.
Located in Silicon Valley, for the past 29 years, Spectrum Semiconductor Materials, Inc. is a World-Wide Authorized Distributor of packages and lids for IC assembly.
TICP provides turnkey solution for Memory, Analog and mixed IC.
USA
SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.
Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
View vendor pageUSA
Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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