IC package

The richest directory of IC Package worldwide. Find the IC Package that matches your needs.

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iC-Haus

Germany

iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.

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Cicor

Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.

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BlackPepper Technologies

BlackPepper Technologies provides High-end value added technology services offering Spec to Silicon, Silicon to System Design, differentiated product & engineering capabilities for global semiconductor companies

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ISE Labs

ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.

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WiWoTech

WiWoTech is a design and development company focused in IC package, silicon validation, wireless system and Smart Antenna design

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Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Services

Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging

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MegaChips LSI USA Corporation

USA

MegaChips provides high performance high quality ASICs in advanced geometries for 5G macro/small cells and repeater, ultra-low power wireless communications, wired/optical communications, image signal processing and nanopore.

Services

RTL Design, FPGA to ASIC conversion, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services

IP Cores

High-speed ADC/DAC, Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, DisplayPort & HDMI, Processor

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Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

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Micross

USA

One-source solution for bare die, post-wafer processing, advanced interconnections, component modification, assembly & test services, hi-rel products to Semiconductor & Aero/Defense industries.

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Trusted Semiconductor

USA

ASIC, FPGA, and custom IC development services including front and back-end design, IP development, package design, manufacturing, assembly, and test.

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V-TEK

USA

Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.

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NedCard

The Netherlands

NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.

Services

Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record

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IC'Alps

France

French semiconductor company specializing in the design and supply of exclusive and custom-made integrated circuit (ASIC & SoC) solutions.

Services

Turnkey ASIC Design & Supply, IC Design Services, Supply Chain Management, ASIC Industrialization, Design and Implementation Expertise

IP Cores

ASIC Reference Designs , Analog, Encryption and authentication , Digital

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Microtek

USA

Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.

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INVECAS

india

A leading silicon-proven IP and ASIC Solutions provider for Advanced Process Technologies along with Embedded Software & System-Level Solutions.

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TES Electronic Solution

Germany

TES Electronic Solutions is a leading full-spectrum global Electronics Design Services Company with headquarter in Germany.

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Spectrum Semiconductor Materials

Located in Silicon Valley, for the past 29 years, Spectrum Semiconductor Materials, Inc. is a World-Wide Authorized Distributor of packages and lids for IC assembly.

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Taiwan IC Packaging Corporation

TICP provides turnkey solution for Memory, Analog and mixed IC.

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Teledyne e2v

Teledyne e2v is an expert in advanced semiconductors assembly and test capabilities which meet very demanding market needs such as Avionics, Aerospace and Space.

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SMART Microsystems

USA

SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.

Services

Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services

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