Find Integrated Circuit Packaging

ICleviathan

Israel

ICleviathan is an multi national IC supply chain company. Established in 2005. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. Our customer base includes, start-ups, system companies and Defence companies.

Services

IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain

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Chain-IC

The Netherlands

Analog and mixed-signal IC development company based in the Netherlands.

Services

IC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation

IP Cores

SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC

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Pacific MicroCHIP

USA

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

Services

Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces

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Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Services

Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

Services

GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability

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Neways Advanced Microsystems

The Netherlands

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging & Assembly

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CMC Microsystems

Canada

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

Services

Fabrication Services, CAD Services, R&D Services

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Cyient Semiconductors

Global

Cyient Semiconductors is a fabless provider delivering custom ASICs, ASSPs, and custom products with end-to-end design and global engineering expertise.

Services

Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration

IP Cores

Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)

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Caliber Interconnect Solutions

India

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.