IC Package Design

TAIPRO Engineering

Belgium

TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.

MAK

Sweden

MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.

Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

iC-Haus

Germany

iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.

Cicor

Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.

ISE Labs

ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.

WiWoTech

WiWoTech is a design and development company focused in IC package, silicon validation, wireless system and Smart Antenna design

Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Micross

USA

One-source solution for bare die, post-wafer processing, advanced interconnections, component modification, assembly & test services, hi-rel products to Semiconductor & Aero/Defense industries.

V-TEK

USA

Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.

IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

NedCard

The Netherlands

NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.

Microtek

USA

Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.

GF Micro

UK

GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.

Spectrum Semiconductor Materials

Located in Silicon Valley, for the past 29 years, Spectrum Semiconductor Materials, Inc. is a World-Wide Authorized Distributor of packages and lids for IC assembly.

Taiwan IC Packaging Corporation

TICP provides turnkey solution for Memory, Analog and mixed IC.

AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

SMART Microsystems

USA

SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.