IC Package Design

The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

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SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Services

Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly

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ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

Services

Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics

IP Cores

Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions

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Custom Silicon Solutions

USA

CSS, a fabless semiconductor leader with 30 years of experience, develops and supplies mixed-signal ASICs to Industrial, Aerospace/Defense, and Medical markets.

Services

Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design

IP Cores

Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References

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LinearASICs

USA

LinearASICs brings more than 25 years of experience in providing a full turn-key ASIC design service with extensive expertise in Analog & Mixed-Signal semiconductors.

Services

Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power

IP Cores

Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)

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Swindon Silicon Systems

UK

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

Services

Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

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Caliber Interconnect Solutions

India

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design

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ALTER Technology

UK

Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.

Services

Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services

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Neways Advanced Microsystems

The Netherlands

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging & Assembly

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Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

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ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Services

Assembly, Test Service, ASE Turnkey Services

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SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

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PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

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HANA Micron

Korea

Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.

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Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

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