IC Packaging Services
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USA
Turnkey provider of packaging design, assembly and test services. Global operations include +8M ft2 of volume production, development, sales & support.
Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageUSA
Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.
Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageSwitzerland
Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.
Services
Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
View vendor pageTaiwan
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.
Services
Assembly, Test Service, ASE Turnkey Services
View vendor pageUSA
SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.
Services
SEMPAC Open-Pak™ Products
View vendor pageUSA
BDI provides the most comprehensive high-speed engineering design, modeling, analysis, measurement, characterization and verification services and solutions.
Services
Package Design, Lab Measurement
View vendor pageFrance
Secure-IC develops trusted computing security technologies for embedded systems to protect them from malevolent attacks and cyber threats.
Germany
PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.
Germany
PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.
Korea
Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.
France
Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.
UK
Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.
UK
PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.
Belgium
TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.
Services
Packaging services, Process/Product industrialization, Full Project Development
View vendor pageIndia
SigIntegrity provides design services related to IC package co-design, ASIC co-design, System Signal integrity, Power integrity analysis & Electromagnetic modeling of silicon & package interconnects.
Services
IC Package design, ASIC co-design, Signal Integrity & Power Integrity, Electromagnetic modeling
View vendor pageRussia
A reliable analog and mixed-signal semiconductor solution source.
Services
Analog IP design , Mixed-signal design , Digital IP design, RF design, ASIC design
View vendor pageUSA
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Services
Test Sockets, Pogo Pins, Custom Connectors
View vendor page 
