IC Packaging Services

Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services.

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Optocap

UK

Fast Turn IC Packaging (Same Day Turn Around Possible) & High Performance IC Packaging for Space & Other Hi-Rel Applications.

Services

Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Tekmos

USA

Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

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ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Services

Assembly, Test Service, ASE Turnkey Services

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SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

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Bayside Design Inc

USA

BDI provides the most comprehensive high-speed engineering design, modeling, analysis, measurement, characterization and verification services and solutions.

Services

Package Design, Lab Measurement

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Secure-IC

France

Secure-IC develops trusted computing security technologies for embedded systems to protect them from malevolent attacks and cyber threats.

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PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

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PREMA Semiconductor

Germany

PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.

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HANA Micron

Korea

Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.

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Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

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Linwave Technology

UK

Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.

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PandA Europe

UK

PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.

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TAIPRO Engineering

Belgium

TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.

Services

Packaging services, Process/Product industrialization, Full Project Development

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SigIntegrity Solutions

India

SigIntegrity provides design services related to IC package co-design, ASIC co-design, System Signal integrity, Power integrity analysis & Electromagnetic modeling of silicon & package interconnects.

Services

IC Package design, ASIC co-design, Signal Integrity & Power Integrity, Electromagnetic modeling

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Milandr

Russia

A reliable analog and mixed-signal semiconductor solution source.

Services

Analog IP design , Mixed-signal design , Digital IP design, RF design, ASIC design

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Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

Services

Test Sockets, Pogo Pins, Custom Connectors

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iC-Haus

Germany

iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.

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