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Manufacturing Services, Failure Analysis & Characterization, Design Services
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Library
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
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ASIC Design, Package Design
PLL Synthesizers, Front-End Modules (Transmitters, Receivers, Transceivers), Voltage Controlled Oscillators (VCOs), Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Bandgap Voltage Reference (BGR), Voltage Regulators, Analog to Digital Converters (ADCs)
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