IC Packaging

ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

PandA Europe

UK

PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.

Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

Teledyne e2v Semiconductors

France

Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.

SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

Infineon

Germany

Infineon is a world leader in semiconductor solutions, which link the real and the digital world.

V-TEK

USA

Collaboration, Innovation and Customization are the cornerstones we use to deliver dependable and highly effective sorting, testing and packaging solutions.

Rochester Electronics

USA

Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.

ISE Labs

ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.

Weasic Microelectronics

Greece

Weasic is the mmWave ASIC enabler. WEASIC IP blocks and Services enable all steps from Concept to Silicon production and assist semiconductor and system companies to shrink the product design cycle

TAIPRO Engineering

Belgium

TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.

NedCard

The Netherlands

NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.

VLC Photonics

Spain

One-Stop development services for Photonic Integrated Circuits.

GF Micro

UK

GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Spectrum Semiconductor Materials

Located in Silicon Valley, for the past 29 years, Spectrum Semiconductor Materials, Inc. is a World-Wide Authorized Distributor of packages and lids for IC assembly.