Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.
This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower power consumption ...
Silicon Valley, CA (Feb 9, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the successful implementation of a high accuracy fiber array waveguide attachment system focused on the Silicon Photonics market. This latest set of tools is based on the double-sided HexNano ...
Nanoprobing is an advanced electrical characterization and fault-localization technique used in semiconductor failure analysis to directly investigate individual transistors, contacts, vias and interconnect structures inside an integrated circuit.
Instead of relying only on package-level electrical measurements, nanoprobing allows extremely small conductive structures on a deprocessed semiconductor die to be contacted using ...
The factors affecting silicon wafer cost are numerous. From the resistivity required for different applications to the physical size of the wafers, and not least the quality grades that separate the pristine from the less perfect; each aspect intricately influences the cost.
As we embark on this explanation, we'll unwrap the ...
When an integrated circuit fails, identifying the damaged component is only part of the challenge. Engineers must determine where the failure occurred, what physical or electrical mechanism caused it, and ultimately why it happened. This requires a combination of specialized IC failure analysis techniques. Some techniques detect electrical abnormalities without physically altering ...
Many important semiconductor package defects are completely hidden from optical inspection. A solder ball can contain a void. A bond wire can be broken inside an encapsulated package. A die-attach layer may contain large areas of voiding. A package substrate can contain an open trace, and an advanced package may have ...
Kaiserslautern, Germany – July 31, 2025 – Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces the release of Version 6.0 of its DVB-S2X Demodulator IP core. This major update introduces powerful enhancements that expand the configurability and technical performance of one of Creonic’s most mature and widely ...
When an integrated circuit fails, one of the first questions is: How is the device failing electrically?
A chip may exhibit excessive leakage current, a short circuit, an open connection, abnormal supply current, a parametric shift or a complete functional failure. Before engineers physically cut into the device, they usually want to ...
Hsinchu, Taiwan -- June 24, 2025 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm process technology. Designed to meet the increasing demands of high-speed data transmission, the new SerDes IP supports a broad ...
