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RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Find companies providing IC FIB Services

The richest directory of ASIC/IC FIB services worldwide. Find the IC FIB services companies that matches your needs.

Scanning Acoustic Microscopy (SAM) for Semiconductor Failure Analysis

Scanning Acoustic Microscopy (SAM) is a non-destructive imaging technique widely used in semiconductor failure analysis to inspect structures and interfaces hidden inside IC packages. Unlike optical microscopy, which relies on visible light, or X-ray inspection, which relies primarily on differences in material density and X-ray absorption, SAM uses high-frequency acoustic waves. This ...

FIB Circuit Edit

What is a Circuit Edit?   A circuit edit is when you need to modify an existing ASIC or integrated circuit for whatever reason. This is usually done with the help of an ion beam that is focused onto the chip to modify it as per the request of the designer. Engineers ...

The 6 Must-Do’s for Semiconductor Fabless Start-ups

Getting funding for a semiconductor startup is not getting easier. According to CBIngishts, there have been fewer than 20 Angel/Seed and Series A deals in the USA in each year since 2009.   So where is all the funding channeled to? In 2013, close to a quarter of all VC funding was ...

Advantest - Company Overview

One of the leading manufacturers of automatic test equipment, Advantest has proven to be one of the leading lights in the semiconductor industry. In addition, they manufacture measuring instruments that are used in the creation of electronic system. You can find Advantest products used in the creation of digital consumer ...

X-Ray Inspection for Semiconductor Package Failure Analysis

Many important semiconductor package defects are completely hidden from optical inspection. A solder ball can contain a void. A bond wire can be broken inside an encapsulated package. A die-attach layer may contain large areas of voiding. A package substrate can contain an open trace, and an advanced package may have ...

Nanoprobing for Semiconductor Failure Analysis

Nanoprobing is an advanced electrical characterization and fault-localization technique used in semiconductor failure analysis to directly investigate individual transistors, contacts, vias and interconnect structures inside an integrated circuit. Instead of relying only on package-level electrical measurements, nanoprobing allows extremely small conductive structures on a deprocessed semiconductor die to be contacted using ...

Gallium Arsenide (GaAs) Overview

Gallium arsenide (GaAs) technology is a type of semiconductor material used in the manufacturing of various electronic devices. It is known for its high electron mobility, which allows it to operate at higher speeds and with lower power consumption compared to other semiconductor materials such as silicon. GaAs technology is ...

Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support

Kaiserslautern, Germany – July 31, 2025 – Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces the release of Version 6.0 of its DVB-S2X Demodulator IP core. This major update introduces powerful enhancements that expand the configurability and technical performance of one of Creonic’s most mature and widely ...