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Germany
Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.
IP Customization, Low power, small footprint Design Methodology, Integration Services on Customer FPGA Boards, System Design, Consulting
IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications
View vendor pageKaiserslautern, Germany – July 31, 2025 – Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces the release of Version 6.0 of its DVB-S2X Demodulator IP core. This major update introduces powerful enhancements that expand the configurability and technical performance of one of Creonic’s most mature and widely ...
The factors affecting silicon wafer cost are numerous. From the resistivity required for different applications to the physical size of the wafers, and not least the quality grades that separate the pristine from the less perfect; each aspect intricately influences the cost. As we embark on this explanation, we'll unwrap the ...
The richest directory of ASIC/IC FIB services worldwide. Find the IC FIB services companies that matches your needs.
Hsinchu, Taiwan -- June 24, 2025 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm process technology. Designed to meet the increasing demands of high-speed data transmission, the new SerDes IP supports a broad ...
October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair ...
When a semiconductor device fails, the visible damage is not necessarily the root cause. A damaged metal line, cracked package, leaking transistor or burned bond wire may be the final result of a sequence of events rather than the original problem. The purpose of the semiconductor failure analysis process is therefore to ...
The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the ...
Overview of Silicon-Germanium (SiGe) Technology and Historical Development Shockley's early transistor game most likely inspired the notion of fusing silicon (Si) and germanium (Ge) to create an alloy for use in transistor engineering. However, this concept has just become a reality in the last 15 years due to the challenges associated ...
When an integrated circuit fails, identifying the damaged component is only part of the challenge. Engineers must determine where the failure occurred, what physical or electrical mechanism caused it, and ultimately why it happened. This requires a combination of specialized IC failure analysis techniques. Some techniques detect electrical abnormalities without physically altering ...
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