Find companies providing IC FIB Services

China Imposes Export Restrictions on Key Minerals to the United States

The Chinese Ministry of Commerce today announced immediate export restrictions on gallium, germanium, antimony, and super-hard materials to the United States. This action cites national security concerns and represents a significant escalation of trade tensions between the two countries. The restrictions follow recent U.S. actions to curb exports of semiconductor-related ...

Semiconductor Failure Analysis Labs by Equipment & Technique

Finding the right semiconductor failure analysis lab often depends less on the laboratory's name and more on whether it has the equipment and technical expertise required for your specific failure. A package delamination problem may require Scanning Acoustic Microscopy. A suspected interconnect defect may require FIB cross-sectioning and SEM inspection. Leakage ...

OBIRCH for Semiconductor Failure Analysis: Resistive Fault Localization

OBIRCH (Optical Beam Induced Resistance Change) is a laser-based fault-localization technique used in semiconductor failure analysis to identify electrically abnormal regions such as resistive shorts, leakage paths, defective vias and interconnect problems. The technique works by scanning a focused laser across an electrically biased semiconductor device. Local laser heating changes the ...

FIB Circuit Edit

What is a Circuit Edit?   A circuit edit is when you need to modify an existing ASIC or integrated circuit for whatever reason. This is usually done with the help of an ion beam that is focused onto the chip to modify it as per the request of the designer. Engineers ...

Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Palo Alto, CA - 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform ...

Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

Understanding Wafer Cost

The factors affecting silicon wafer cost are numerous. From the resistivity required for different applications to the physical size of the wafers, and not least the quality grades that separate the pristine from the less perfect; each aspect intricately influences the cost.     As we embark on this explanation, we'll unwrap the ...

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Common IC Failure Mechanisms and Their Causes

Integrated circuits can fail for many different reasons. Some failures originate inside the semiconductor die, while others result from packaging, manufacturing, assembly, electrical overstress or the environment in which the device operates. Common IC failure mechanisms include electrostatic discharge (ESD), electrical overstress (EOS), electromigration, dielectric breakdown, interconnect defects, corrosion, contamination, thermal ...

X-Ray Inspection for Semiconductor Package Failure Analysis

Many important semiconductor package defects are completely hidden from optical inspection. A solder ball can contain a void. A bond wire can be broken inside an encapsulated package. A die-attach layer may contain large areas of voiding. A package substrate can contain an open trace, and an advanced package may have ...