Find companies providing IC FIB Services

The richest directory of ASIC/IC FIB services worldwide. Find the IC FIB services companies that matches your needs.

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RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Services

Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services

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Analogue Insight

UK

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Services

Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting

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ASIC Design for Silicon Photonics

Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.   This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower power consumption ...

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Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

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Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support

Kaiserslautern, Germany – July 31, 2025 – Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces the release of Version 6.0 of its DVB-S2X Demodulator IP core. This major update introduces powerful enhancements that expand the configurability and technical performance of one of Creonic’s most mature and widely ...

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BCD, CMOS, FinFET, SOI, GaN & SiC Technologies Explained

Introduction to Semiconductor Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors. Doping ...

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Understanding Silicon Photonics Market, Technology and Applications

With a rapid progression in the applications involving artificial intelligence, data generation has been increased exponentially in last few years. It has been estimated that in 2018, 2,5 quintillion bytes of data is generated every day [1]. This huge data generation puts enormous computational requirements on telecom platforms and  data ...

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Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

Services

IP Customization, Low power, small footprint Design Methodology, Integration Services on Customer FPGA Boards, System Design, Consulting

IP Cores

IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications

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Creonic’s DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard

Creonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies.   The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based data delivery.  With ...

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Choosing, Integrating and Managing Chiplets

Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or "chiplets." These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex ...

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