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Understanding Wafer Cost

The factors affecting silicon wafer cost are numerous. From the resistivity required for different applications to the physical size of the wafers, and not least the quality grades that separate the pristine from the less perfect; each aspect intricately influences the cost.     As we embark on this explanation, we'll unwrap the ...

Creonic’s DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard

Creonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies.   The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based data delivery.  With ...

Choosing, Integrating and Managing Chiplets

Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or "chiplets." These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex ...

Qmode project with QuiX

The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the ...

Comparing Au, Pt, Ag and Cu Wire Bonding

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf ...

Focused Ion Beam (FIB)

Integrated circuit (IC) designers are learning that a technique long used on older process nodes is providing even more valuable benefits as they develop devices to be manufactured at advanced technology nodes, including 28nm and beyond. During a period when it takes $10 million or more to bring a device ...

Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

INTEGRA TECHNOLOGIES EXPANDS SILICON PHOTONICS CAPABILITIES

Silicon Valley, CA (Feb 9, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the successful implementation of a high accuracy fiber array waveguide attachment system focused on the Silicon Photonics market. This latest set of tools is based on the double-sided HexNano ...

PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.