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Finding the right semiconductor failure analysis lab often depends less on the laboratory's name and more on whether it has the equipment and technical expertise required for your specific failure. A package delamination problem may require Scanning Acoustic Microscopy. A suspected interconnect defect may require FIB cross-sectioning and SEM inspection. Leakage ...
Semiconductor devices can fail for many reasons: manufacturing defects, electrical overstress, electrostatic discharge, contamination, packaging problems, excessive temperature, mechanical stress, aging or defects introduced during assembly. Finding the actual cause of an IC failure, however, is rarely as simple as looking at the damaged device. Semiconductor failure analysis (FA) is the systematic ...
Germany
RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.
Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
View vendor pageCreonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies. The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based data delivery. With ...
Germany
Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.
IP Customization, Low power, small footprint Design Methodology, Integration Services on Customer FPGA Boards, System Design, Consulting
IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications
View vendor pageThe Chinese Ministry of Commerce today announced immediate export restrictions on gallium, germanium, antimony, and super-hard materials to the United States. This action cites national security concerns and represents a significant escalation of trade tensions between the two countries. The restrictions follow recent U.S. actions to curb exports of semiconductor-related ...
The NVM Express (NVMe) specification has been introduced in 2011. Five years later, it is definitely adopted as the new standard storage interface for Solid-State Drives (SSD). Even if SAS and SATA SSDs are still dominating the market (in unit shipment), the PCIe SSD market share is growing fast and ...
Once an electrical failure has been localized inside an integrated circuit, the next challenge is determining what physically went wrong. Was a metal interconnect broken? Did a via fail? Is there contamination between two structures? Has a dielectric layer broken down? Is a transistor structure abnormal? Or did the failure originate in the ...
Many semiconductor failure-analysis techniques require direct access to structures that are hidden inside an IC package. The semiconductor die, bond pads, bond wires and other critical components may be completely covered by epoxy molding compound or other packaging materials. Before these structures can be examined using techniques such as optical microscopy, emission ...
Nanoprobing is an advanced electrical characterization and fault-localization technique used in semiconductor failure analysis to directly investigate individual transistors, contacts, vias and interconnect structures inside an integrated circuit. Instead of relying only on package-level electrical measurements, nanoprobing allows extremely small conductive structures on a deprocessed semiconductor die to be contacted using ...
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