The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Library
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ASIC Design, Package Design
PLL Synthesizers, Front-End Modules (Transmitters, Receivers, Transceivers), Voltage Controlled Oscillators (VCOs), Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Bandgap Voltage Reference (BGR), Voltage Regulators, Analog to Digital Converters (ADCs)
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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