https://isine.com/
 

IC Packaging Services

Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services.

69 results found See AllSend Email to All

Categories
IOs and Library IP
Today’s News
Find Vendors IP Cores

Find ASIC Services

Find IP Cores

Get Price Offers From
Welcome New Vendors
Recent Posts
Most Popular Blog Posts
Tools

Caliber Interconnect Solutions

India

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design

View vendor page

SmartSoC Solutions

India

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Services

RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services

View vendor page

VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

View vendor page

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

View vendor page

Alphacore

USA

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

View vendor page

Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

View vendor page

SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Services

Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly

View vendor page

LinearASICs

USA

LinearASICs brings more than 25 years of experience in providing a full turn-key ASIC design service with extensive expertise in Analog & Mixed-Signal semiconductors.

Services

Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power

IP Cores

Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)

View vendor page

Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

View vendor page

Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

View vendor page

GS Microelectronics

USA

GSME is a global provider of customized silicon solutions including RF design, power management ICs, manufacturing operations, and Quality Assurance (QA) to IC design and system companies.

Services

Manufacturing Services, Failure Analysis & Characterization, Design Services

View vendor page

EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

Services

Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain

View vendor page

ALTER Technology

UK

Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.

Services

Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services

View vendor page

GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

View vendor page

Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

View vendor page

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

View vendor page

Microdul

Switzerland

Microdul AG (ISO9001/ISO13485). Miniaturized Microelectronic Modules, Ultra-Low-Power ASICs (nA, nW) and Thick-Film.

Services

ASIC development & supply, ASIC Industrialization, Modules, Thick-film

View vendor page

Neways Advanced Microsystems

The Netherlands

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging & Assembly

View vendor page

Rochester Electronics

USA

Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.

Services

Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing

View vendor page

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Services

Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)

View vendor page