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USA
Test Spectrum is committed to excellence in semiconductor test solutions through dedication to experience, execution and integrity. ITAR Certified.
ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.
UK
GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageUSA
Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.
IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
View vendor pageUSA
SV Probe is an innovative, solutions driven designer that manufactures, markets and services high performance probe cards used within the semiconductor industry.
Cantilever Probe Cards, Vertical Probe Cards
View vendor pageUSA
Essai delivers custom engineered and manufactured products to fit the most complicated requirements and meet the most demanding schedules. Essai Specializes in the manufacturing of BGA Sockets LGA Sockets IC Sockets High Speed Sockets,BGA Contactors Interposers, Test Interfaces Test Tooling Test Boards ATE Boards DIB Boards DUT Boards, and Board Adapters.
PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
View vendor pageUK
Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
View vendor pageIsrael
Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.
USA
Xcerra Corporation is comprised of four businesses in the semiconductor and electronics manufacturing test markets: atg Luther & Maelzer, Everett Charles Technologies, LTX-Credence and Multitest.
France
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageUSA
30 years of cutting-edge mixed-signal design expertise to provide solutions to your most challenging problems.
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
View vendor pageUSA
Founded in 1979, TSSI is leading the innovative methodologies to automate EDA-to-ATE vector translation and re-simulation tasks for first-time success.
Taiwan
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.
Assembly, Test Service, ASE Turnkey Services
View vendor pageUSA
Pioneer in the design and manufacture of innovative precision sockets used to test ICs and place them onto PC boards.
USA
GSME is a global provider of customized silicon solutions including RF design, power management ICs, manufacturing operations, and Quality Assurance (QA) to IC design and system companies.
Manufacturing Services, Failure Analysis & Characterization, Design Services
View vendor pageBelgium
Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.
More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
View vendor pageKorea
Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.
USA
Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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