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Semiconductor Failure Analysis Labs by Equipment & Technique

Finding the right semiconductor failure analysis lab often depends less on the laboratory's name and more on whether it has the equipment and technical expertise required for your specific failure. A package delamination problem may require Scanning Acoustic Microscopy. A suspected interconnect defect may require FIB cross-sectioning and SEM inspection. Leakage ...

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

Faraday Unveils ASIC Success in Factory Automation

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance ...

Emission Microscopy (EMMI) for Semiconductor Failure Analysis

Emission Microscopy (EMMI) is an optical fault-localization technique used in semiconductor failure analysis to identify electrically active defects inside integrated circuits. Instead of physically opening individual circuit structures and searching for damage, emission microscopy detects extremely weak light generated while a semiconductor device is electrically operating or biased. Abnormal photon emission ...

Comparing Au, Pt, Ag and Cu Wire Bonding

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf ...

Chipmaker Broadcom to Acquire Brocade for $5.9 Billion

SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) -- Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75 ...

ficonTEC and PHIX partner to enable high-volume manufacturing of multi-chip photonic modules

PHIX B.V. of Enschede, The Netherlands, is a Dutch packaging foundry that assembles their customers’ photonic integrated circuits into complete modules. As these modules evolve from initial prototypes into mature products, the manufacturing volumes become much larger and a higher level of automation is required. This aspect of photonic device ...

Silicon Photonics Inflection Point - It’s Not ‘If,’ It’s ‘When’

Lately, there’s been a lot of buzz about silicon photonics in the data center industry. What’s it all about? The ever-expanding digital universe is being driven by cloud computing, mobile data, video streaming, and Internet-of-Things (IoT). Today, it’s estimated that by end of 2016, more than 6 zettabytes (i.e., the ...

Introduction to Silicon-Germanium (SiGe) Technology

Overview of Silicon-Germanium (SiGe) Technology and Historical Development   Shockley's early transistor game most likely inspired the notion of fusing silicon (Si) and germanium (Ge) to create an alloy for use in transistor engineering. However, this concept has just become a reality in the last 15 years due to the challenges associated ...

IC Short Circuit Failure Analysis | Locate Semiconductor Shorts

IC short circuit failure analysis is the process of determining where an unintended electrical connection exists inside a semiconductor device, package or interconnect structure and identifying the physical defect that created the short. A short circuit may initially appear only as excessive supply current, unexpectedly low resistance between two nodes, abnormal ...