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Understanding Silicon Photonics Market, Technology and Applications

With a rapid progression in the applications involving artificial intelligence, data generation has been increased exponentially in last few years. It has been estimated that in 2018, 2,5 quintillion bytes of data is generated every day [1]. This huge data generation puts enormous computational requirements on telecom platforms and  data ...

Package Failure Analysis Services | IC Package FA Lab

Package failure analysis is the systematic investigation of defects and failures originating within semiconductor packaging, interconnects, solder connections, die attach, bond wires, redistribution layers and other structures that connect the semiconductor die to the outside system. A semiconductor device may fail electrical testing even though the silicon itself is functioning correctly. ...

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

IC Short Circuit Failure Analysis | Locate Semiconductor Shorts

IC short circuit failure analysis is the process of determining where an unintended electrical connection exists inside a semiconductor device, package or interconnect structure and identifying the physical defect that created the short. A short circuit may initially appear only as excessive supply current, unexpectedly low resistance between two nodes, abnormal ...

Choosing, Integrating and Managing Chiplets

Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or "chiplets." These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex ...

Physical Failure Analysis (PFA) of Semiconductor Devices

Once an electrical failure has been localized inside an integrated circuit, the next challenge is determining what physically went wrong.  Was a metal interconnect broken?  Did a via fail?  Is there contamination between two structures? Has a dielectric layer broken down? Is a transistor structure abnormal? Or did the failure originate in the ...

Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers

  Dr. Morris Chang is not my hero. He might be the most important person in the semiconductor industry in our lifetime, but he is not my hero. I have nothing against him. I’ve never met him and probably will never will. Instead, I meet my heroes usually after tape-out, when ...

OBIRCH for Semiconductor Failure Analysis: Resistive Fault Localization

OBIRCH (Optical Beam Induced Resistance Change) is a laser-based fault-localization technique used in semiconductor failure analysis to identify electrically abnormal regions such as resistive shorts, leakage paths, defective vias and interconnect problems. The technique works by scanning a focused laser across an electrically biased semiconductor device. Local laser heating changes the ...

Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production

Hsinchu, Taiwan -- July 11, 2023 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, launched its SerDes (serializer/deserializer) total solution comprises SerDes IP design on UMC 28nm and the corresponding IP advanced (IPA) service which includes IP subsystem integration, PHY hardcore implementation, and signal integrity/power ...

ASIC Design for Silicon Photonics

Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.   This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower power consumption ...