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ASIC Design: From Spec to Chips

An Application Specific Integrated Circuit (ASIC) is a specialized integrated circuit crafted for a particular use or purpose. Typically, ASICs are tailored for products targeted for mass production, consolidating necessary electronics onto a single chip.     ASIC stands for “Application Specific Integrated Circuit.”   Despite the substantial initial design cost (known as NRE - ...

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Abrel Products

Ireland

Abrel design and manufacture products for the reliability testing of semiconductor components.

Services

Burn-in Boards, Hast Boards

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What is a Burn-in Board?

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...

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FormFactor Named #1 Global Supplier in Test Subsystems and Focused Chip Making Equipment

LIVERMORE, Calif., May 27, 2025 (GLOBE NEWSWIRE) – FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, has been named the #1 global supplier in both the Test Subsystems and Focused Chip Making Equipment categories in TechInsights’ 2025 global semiconductor industry customer satisfaction survey. The company earned five-star ...

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Integrated Circuit Packaging Overview

An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...

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Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

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Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...

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SAS Advanced Technologies

Israel

Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.

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Semiconductor Test Equipment is Powering Innovation

OUTLINE Semiconductor probe card revenues are down by 0.5% in 2022. Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high. Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs. The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics. The Top 3 ...

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Industry Trend: Evolution of Semiconductor Chip Companies to Complex Product and Service Organizations

As technologies advance, the semiconductor industry and its traditional business model face a myriad of ongoing complexities demanding an ever accelerating state of operational agility. The electronics and healthcare markets are experiencing unprecedented change through mass market consumerization and global adoption. For most chip companies, gone are the days of ...

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