Find IC test socket

The richest directory of ic test socket worldwide. Find the ic test socket that matches your needs.

30 results found See AllSend Email to All

Low Parasitic HBM ESD Testing

The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...

View article

Synergie-CAD

UK

30 years producing Semiconductor test solutions (Hardware and Software). Design, Simulation, Manufacture, Assembly, Test Development and more, all by Synergie-CAD.

Services

Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems

View vendor page

Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

View article

Verification IP : Changing landscape

For decades, EDA industry has been working out options to improve their offerings and ensure silicon success for the semiconductor industry. A few decades back, while the EDA giants were unknown, design automation was exercised individually in every organization developing a product. Gradually these tools moved out of the design ...

View article

Integrated Circuit Packaging Overview

An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...

View article

M Specialties

USA

M&M Specialties offers Engineering, Design, Manufacturing and Assembly services for semiconductor specific Test Boards and Test Sockets

View vendor page

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...

View article

Semiconductor Test Equipment is Powering Innovation

OUTLINE Semiconductor probe card revenues are down by 0.5% in 2022. Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high. Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs. The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics. The Top 3 ...

View article

Find BGA test socket

The richest directory of BGA test socket worldwide. Find the BGA test socket that matches your needs.

View article

IC Insights Bulletin: Nvidia’s $40 Billion ARM Purchase Will Test Current M&A “Ceiling”

After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan.  If approved, the deal would be the largest semiconductor acquisition ...

View article
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.