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ATS Engineering and ChipTest Announce Strategic Collaboration for Test Program Development for Advantest’s customers

Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...

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Six ways to improve chip yield rate- before the project starts

Early on in Chip projects, yield is not taken very seriously. The common thinking goes -  anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...

ASIC Design: From Spec to Chips

An Application Specific Integrated Circuit (ASIC) is a specialized integrated circuit crafted for a particular use or purpose. Typically, ASICs are tailored for products targeted for mass production, consolidating necessary electronics onto a single chip.     ASIC stands for “Application Specific Integrated Circuit.”   Despite the substantial initial design cost (known as NRE - ...

ASIC design for the IoT

As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?   In a nutshell, because ...

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IC Package Types and How to Choose One?

Introduction to Integrated Circuit Packaging   Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.    Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...

Semiconductor Test Equipment is Powering Innovation

OUTLINE Semiconductor probe card revenues are down by 0.5% in 2022. Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high. Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs. The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics. The Top 3 ...

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...

What is Semiconductors 3.0?

I am sick and tired to hear the same buzzwords a zillion times every single day. IoT, Cognitive Computing, Cloud Computing, Fog Computing, Big Data, Artificial Intelligence, Smart-whatever (from objects to cities and pretty soon toilet paper, I'm afraid). What really makes me sick is that these buzzwords are used, ...