For decades, EDA industry has been working out options to improve their offerings and ensure silicon success for the semiconductor industry. A few decades back, while the EDA giants were unknown, design automation was exercised individually in every organization developing a product. Gradually these tools moved out of the design ...
The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...
As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?
In a nutshell, because ...
HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...
OUTLINE
Semiconductor probe card revenues are down by 0.5% in 2022.
Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high.
Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs.
The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics.
The Top 3 ...
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
