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FormFactor Named #1 Global Supplier in Test Subsystems and Focused Chip Making Equipment

LIVERMORE, Calif., May 27, 2025 (GLOBE NEWSWIRE) – FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, has been named the #1 global supplier in both the Test Subsystems and Focused Chip Making Equipment categories in TechInsights’ 2025 global semiconductor industry customer satisfaction survey. The company earned five-star ...

Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

ASIC design for the IoT

As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?   In a nutshell, because ...

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...

The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.     Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry?   DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...

What is a Burn-in Board?

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...

Gold Technologies

USA

With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.

Six ways to improve chip yield rate- before the project starts

Early on in Chip projects, yield is not taken very seriously. The common thinking goes -  anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Introduction to LoadBoard Design and Production

LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester.    It is one piece of the entire ASIC Test Solution and it ...