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My Golden Rule for Chip Production Testing

Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost.   Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...

SAS Advanced Technologies

Israel

Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

What is a Burn-in Board?

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...

Integrated Circuit Packaging Overview

An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...

Six ways to improve chip yield rate- before the project starts

Early on in Chip projects, yield is not taken very seriously. The common thinking goes -  anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...

IC Insights Bulletin: Nvidia’s $40 Billion ARM Purchase Will Test Current M&A “Ceiling”

After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan.  If approved, the deal would be the largest semiconductor acquisition ...

Andon Electronics

USA

Pioneer in the design and manufacture of innovative precision sockets used to test ICs and place them onto PC boards.

IC Package Types and How to Choose One?

Introduction to Integrated Circuit Packaging   Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.    Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...

Low Parasitic HBM ESD Testing

The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...