Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...
As technologies advance, the semiconductor industry and its traditional business model face a myriad of ongoing complexities demanding an ever accelerating state of operational agility. The electronics and healthcare markets are experiencing unprecedented change through mass market consumerization and global adoption. For most chip companies, gone are the days of ...
As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?
In a nutshell, because ...
I am sick and tired to hear the same buzzwords a zillion times every single day. IoT, Cognitive Computing, Cloud Computing, Fog Computing, Big Data, Artificial Intelligence, Smart-whatever (from objects to cities and pretty soon toilet paper, I'm afraid). What really makes me sick is that these buzzwords are used, ...
Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost.
Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
Introduction to Integrated Circuit Packaging
Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...
LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester.
It is one piece of the entire ASIC Test Solution and it ...
