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Introduction to LoadBoard Design and Production

LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester.    It is one piece of the entire ASIC Test Solution and it ...

Semiconductor Test Equipment is Powering Innovation

OUTLINE Semiconductor probe card revenues are down by 0.5% in 2022. Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high. Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs. The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics. The Top 3 ...

FormFactor Named #1 Global Supplier in Test Subsystems and Focused Chip Making Equipment

LIVERMORE, Calif., May 27, 2025 (GLOBE NEWSWIRE) – FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, has been named the #1 global supplier in both the Test Subsystems and Focused Chip Making Equipment categories in TechInsights’ 2025 global semiconductor industry customer satisfaction survey. The company earned five-star ...

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Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Six ways to improve chip yield rate- before the project starts

Early on in Chip projects, yield is not taken very seriously. The common thinking goes -  anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...

IC Package Types and How to Choose One?

Introduction to Integrated Circuit Packaging   Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.    Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...

ATS Engineering and ChipTest Announce Strategic Collaboration for Test Program Development for Advantest’s customers

Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...

Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...