After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan. If approved, the deal would be the largest semiconductor acquisition ...
LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester.
It is one piece of the entire ASIC Test Solution and it ...
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...
The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...
This interview features Scott Bulbrook, President of DA-Integrated.
Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...
Introduction to Integrated Circuit Packaging
Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...
Early on in Chip projects, yield is not taken very seriously. The common thinking goes - anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings.
1- Know your ...
