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USA
Pioneer in the design and manufacture of innovative precision sockets used to test ICs and place them onto PC boards.
USA
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Test Sockets, Pogo Pins, Custom Connectors
View vendor pageEarly on in Chip projects, yield is not taken very seriously. The common thinking goes - anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done? In a nutshell, because ...
Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost. Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...
After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan. If approved, the deal would be the largest semiconductor acquisition ...
An Application Specific Integrated Circuit (ASIC) is a specialized integrated circuit crafted for a particular use or purpose. Typically, ASICs are tailored for products targeted for mass production, consolidating necessary electronics onto a single chip. ASIC stands for “Application Specific Integrated Circuit.” Despite the substantial initial design cost (known as NRE - ...
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...
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