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Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
As technologies advance, the semiconductor industry and its traditional business model face a myriad of ongoing complexities demanding an ever accelerating state of operational agility. The electronics and healthcare markets are experiencing unprecedented change through mass market consumerization and global adoption. For most chip companies, gone are the days of ...
Malaysia
Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.
Test Design & Development, Probe Card & Loadboard Design and Fabrication, Socket & Pin Solutions, High Volume/Low Mix or High Mix/Low Volume Testing, Backend AOI, Bake & Pack Services, IR4.0 Smart System Automation
View vendor pageThis interview features Scott Bulbrook, President of DA-Integrated. Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry? DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...
Application-Specific Integrated Circuits (ASICs) and SoCs play a critical role in modern technological advancements. These customized integrated circuits are designed to cater to specific applications, offering optimized performance, power efficiency, and cost-effectiveness. Understanding the economics behind ASICs is essential for businesses and industries that rely on these chips. This article ...
Early on in Chip projects, yield is not taken very seriously. The common thinking goes - anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...
UK
30 years producing Semiconductor test solutions (Hardware and Software). Design, Simulation, Manufacture, Assembly, Test Development and more, all by Synergie-CAD.
Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
View vendor pageOpen-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...
The richest directory of ic test socket worldwide. Find the ic test socket that matches your needs.
After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan. If approved, the deal would be the largest semiconductor acquisition ...
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