Application-Specific Integrated Circuits (ASICs) and SoCs play a critical role in modern technological advancements. These customized integrated circuits are designed to cater to specific applications, offering optimized performance, power efficiency, and cost-effectiveness. Understanding the economics behind ASICs is essential for businesses and industries that rely on these chips. This article ...
Introduction to Integrated Circuit Packaging
Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...
Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost.
Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...
Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...
This interview features Scott Bulbrook, President of DA-Integrated.
Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...
Early on in Chip projects, yield is not taken very seriously. The common thinking goes - anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings.
1- Know your ...
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...
