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What is Semiconductors 3.0?

I am sick and tired to hear the same buzzwords a zillion times every single day. IoT, Cognitive Computing, Cloud Computing, Fog Computing, Big Data, Artificial Intelligence, Smart-whatever (from objects to cities and pretty soon toilet paper, I'm afraid). What really makes me sick is that these buzzwords are used, ...

SAS Advanced Technologies

Israel

Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.

Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

Introduction to LoadBoard Design and Production

LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester.    It is one piece of the entire ASIC Test Solution and it ...

The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.     Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry?   DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Low Parasitic HBM ESD Testing

The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...

My Golden Rule for Chip Production Testing

Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost.   Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...