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Introduction to HTOL

HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...

Integrated Circuit Packaging Overview

An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Six ways to improve chip yield rate- before the project starts

Early on in Chip projects, yield is not taken very seriously. The common thinking goes -  anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...

Abrel Products

Ireland

Abrel design and manufacture products for the reliability testing of semiconductor components.

CoreTest Technologies

UK

CoreTest Technologies provides a wide array of semiconductor test equipment from sockets to ATE

M Specialties

USA

M&M Specialties offers Engineering, Design, Manufacturing and Assembly services for semiconductor specific Test Boards and Test Sockets

My Golden Rule for Chip Production Testing

Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost.   Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...

Industry Trend: Evolution of Semiconductor Chip Companies to Complex Product and Service Organizations

As technologies advance, the semiconductor industry and its traditional business model face a myriad of ongoing complexities demanding an ever accelerating state of operational agility. The electronics and healthcare markets are experiencing unprecedented change through mass market consumerization and global adoption. For most chip companies, gone are the days of ...

Highest Performance Interlaken Chip-to-Chip Interface IP Core

Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...