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Chip production testing is probably the most underestimated task by ASIC development engineers. And yet, testing is an essential step with a direct impact on final chip cost. Let’s start with the basics. Testing of chips is necessary because the chip manufacturing process cannot provide 100% yield. Silicon foundries and assembly ...
Introduction to Integrated Circuit Packaging Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today. Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor ...
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Test Design & Development, Probe Card & Loadboard Design and Fabrication, Socket & Pin Solutions, High Volume/Low Mix or High Mix/Low Volume Testing, Backend AOI, Bake & Pack Services, IR4.0 Smart System Automation
View vendor pageEarly on in Chip projects, yield is not taken very seriously. The common thinking goes - anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings. 1- Know your ...
As technologies advance, the semiconductor industry and its traditional business model face a myriad of ongoing complexities demanding an ever accelerating state of operational agility. The electronics and healthcare markets are experiencing unprecedented change through mass market consumerization and global adoption. For most chip companies, gone are the days of ...
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact ...
LoadBoard (LB) is a mandatory, custom made PCB, that acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). LoadBoard has well-defined physical dimensions and it must fit perfectly into the tester. It is one piece of the entire ASIC Test Solution and it ...
Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...
HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...
Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...
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