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Ireland
Abrel design and manufacture products for the reliability testing of semiconductor components.
Burn-in Boards, Hast Boards
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The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...
This interview features Scott Bulbrook, President of DA-Integrated. Can you describe your company's founding vision and how it has evolved to address the changing landscape of the semiconductor industry? DA-Integrated was founded to address a gap in the industry concerning the availability of test development services for leading-edge Application Specific Integrated Circuits ...
For decades, EDA industry has been working out options to improve their offerings and ensure silicon success for the semiconductor industry. A few decades back, while the EDA giants were unknown, design automation was exercised individually in every organization developing a product. Gradually these tools moved out of the design ...
UK
CoreTest Technologies provides a wide array of semiconductor test equipment from sockets to ATE
The richest directory of BGA test socket worldwide. Find the BGA test socket that matches your needs.
HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform ...
USA
With its own Engineering and Manufacturing facility and expertise, Gold Technologies can design and manufacture what you need in semiconductor testing – from spring probe pogo pins to connectors to test sockets/contactors – from prototype, validation, characterization to high volume ATE and Burn In.
Test Sockets, Pogo Pins, Custom Connectors
View vendor pageOpen-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...
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