Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, ...
Application-Specific Integrated Circuits (ASICs) and SoCs play a critical role in modern technological advancements. These customized integrated circuits are designed to cater to specific applications, offering optimized performance, power efficiency, and cost-effectiveness. Understanding the economics behind ASICs is essential for businesses and industries that rely on these chips. This article ...
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and ...
I am sick and tired to hear the same buzzwords a zillion times every single day. IoT, Cognitive Computing, Cloud Computing, Fog Computing, Big Data, Artificial Intelligence, Smart-whatever (from objects to cities and pretty soon toilet paper, I'm afraid). What really makes me sick is that these buzzwords are used, ...
OUTLINE
Semiconductor probe card revenues are down by 0.5% in 2022.
Reaching US$1.84 billion in 2022, revenue from sockets is on track to reach a record high.
Revenue from advanced PCBs grew overall in 2022, driven by sales of DIBs.
The Top 3 probe card suppliers are FormFactor, Technoprobe, and MJC Electronics.
The Top 3 ...
Tel Aviv, Israel – March 24, 2022 - ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS ...
The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures ...
As everybody is trying to figure out what the Internet of Things (IoT) will look like and how connected things will work, I'd like to address a question that many people have: why design your own Integrated Circuit (IC) rather than just use an off-the-shelf processor, write software and be done?
In a nutshell, because ...
