Integrated Circuit Packaging
The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.
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USA
Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
Services
QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
View vendor pageSweden
Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.
Services
ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
IP Cores
RF, Analog, Power, Digital
View vendor pageGermany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor pageUK
We partner companies, start-ups and academia to design and develop innovative, leading-edge ASIC solutions across multi-domain applications.
Services
Chip Design and Development, Implementation, Turnkey solutions, Speciality Services
IP Cores
12 bit SAR ADC, Digital temperature sensor
View vendor pageUSA
Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.
Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
View vendor pageUSA
SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.
Services
Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
View vendor pageUSA
MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.
Services
RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
IP Cores
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
View vendor pageSwitzerland
Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.
Services
Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
View vendor pageTaiwan
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.
Services
Assembly, Test Service, ASE Turnkey Services
View vendor pageUSA
SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.
Services
SEMPAC Open-Pak™ Products
View vendor pageFrance
Secure-IC develops trusted computing security technologies for embedded systems to protect them from malevolent attacks and cyber threats.
Germany
PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.
Germany
PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.
Korea
Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.
France
Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.
UK
Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.
UK
PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.
Belgium
TAIPRO Engineering is an unique one stop shop service in Europe for designing and producing your tailored sensor solutions.
Services
Packaging services, Process/Product industrialization, Full Project Development
View vendor pageIndia
SigIntegrity provides design services related to IC package co-design, ASIC co-design, System Signal integrity, Power integrity analysis & Electromagnetic modeling of silicon & package interconnects.
Services
IC Package design, ASIC co-design, Signal Integrity & Power Integrity, Electromagnetic modeling
View vendor page 
