Integrated Circuit Packaging

The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Infineon

Germany

Infineon is a world leader in semiconductor solutions, which link the real and the digital world.

Services

Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics

IP Cores

IP Library

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TES Electronic Solutions

Germany

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Services

ASIC design and supply chain management, ASIC design services

IP Cores

Video and Graphics, Digital IP, Analog IP

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ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Services

Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design

IP Cores

RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital

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Microdul

Switzerland

Microdul AG (ISO9001/ISO13485). Miniaturized Microelectronic Modules, Ultra-Low-Power ASICs (nA, nW) and Thick-Film.

Services

ASIC development & supply, ASIC Industrialization, Modules, Thick-film

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Swindon Silicon Systems

UK

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

Services

Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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GF Micro

UK

GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.

Services

Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding

IP Cores

12 bit SAR ADC, Digital temperature sensor

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

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ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Services

Assembly, Test Service, ASE Turnkey Services

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SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

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PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

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HANA Micron

Korea

Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.

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Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

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