The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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UK
Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
View vendor pageUK
EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
View vendor pageSweden
Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.
Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
View vendor pageUSA
asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageIndia
Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageMalaysia
Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.
Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
View vendor pageUSA
Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.
IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
View vendor pageUSA
Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
View vendor pageFrance
Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
View vendor pageIsrael
ICleviathan is an multi national IC supply chain company. Established in 2005. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. Our customer base includes, start-ups, system companies and Defence companies.
IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
View vendor pageIndia
BLRLABS is a VLSI company. We specialize in SoC Physical Design (RTL-To-GDS2) Turnkey execution, offering Services in RTL design, DFT, Verification in ASIC & FPGA.
IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
View vendor pageIsrael
Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
View vendor pageSwitzerland
Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.
Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
View vendor pageTaiwan
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.
Assembly, Test Service, ASE Turnkey Services
View vendor pageUSA
SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.
SEMPAC Open-Pak™ Products
View vendor pageGermany
PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.
Korea
Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.
France
Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.
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