The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
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Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services
RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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