The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
SiFive HBM2/2E (High Bandwidth Memory) Subsystem IP, SiFive Interlaken IP Core, SiFive PCS (Physical Coding Sublayer) IP, SiFive MCMR FEC (Forward Error Correction) IP Core, SiFive 100G Ethernet PCS IP, SiFive 100G Ethernet MAC IP, SiFive FlexE (Flexible Ethernet) IP, SiFive USB1.1 FS Function Controller, SiFive USB2.0 FS Dual Role Controller, SiFive USB 2.0 Multi-Point USB HS OTG Controller, SiFive USB 2.0 High-Speed Function Controller, SiFive USB3.2 Gen2 single lane Re-Timer IP Core, SiFive USB3.0 DR-OTG Controller IP Cores, SiFive USB3.2 Gen2 IP Core
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
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