The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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