Semiconductor Packaging

The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.

74 results found See AllSend Email to All

Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

View vendor page

VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

View vendor page

Custom Silicon Solutions

USA

CSS, a fabless semiconductor leader with 30 years of experience, develops and supplies mixed-signal ASICs to Industrial, Aerospace/Defense, and Medical markets.

Services

Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design

IP Cores

Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References

View vendor page

SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Services

Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly

View vendor page

Alphacore

USA

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

View vendor page

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Services

ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services

View vendor page

ALTER Technology

UK

Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.

Services

Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services

View vendor page

E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

View vendor page

Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

View vendor page

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

Services

IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services

IP Cores

RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)

View vendor page

Neways Advanced Microsystems

The Netherlands

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging & Assembly

View vendor page

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

Services

GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability

View vendor page

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

View vendor page

Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

View vendor page

Black Forest Engineering

USA

30 years of cutting-edge mixed-signal design expertise to provide solutions to your most challenging problems.

Services

Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design

IP Cores

Column ADC Patent, Extensive IP Library

View vendor page

TES Electronic Solutions

Germany

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Services

ASIC design and supply chain management, ASIC design services

IP Cores

Video and Graphics, Digital IP, Analog IP

View vendor page

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

View vendor page

ASE Group

Taiwan

We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.

Services

Assembly, Test Service, ASE Turnkey Services

View vendor page

SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

View vendor page

PacTech

Germany

PAC TECH manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level packaging contract manufacturing out of Germany (HQ), USA and Malaysia.

View vendor page
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.