The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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ASIC Turnkey Service / ASIC Prototyping Service, IC Design Services, Power Semiconductor Turnkey Service
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services
RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)
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ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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RTL Design and Verification, Design Verification, Design For Test, Physical Design, Static Timing Analysis, Post Silicon Validation
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
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Test and Qualification, OSAT, Component Modification, Supply Chain Services, Advanced Packaging, Wafer Processing
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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