The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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IC design and services, Silicon IP design and services, ASIC design services, DPD design services, PCB design services
RF-DAC, High speed DAC and ADC, General purpose clock generator - PLL, High speed bi-directional Interface (SerDes)
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design
Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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