The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
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Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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IC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation
SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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ASIC Turnkey Service / ASIC Prototyping Service, IC Design Services, Power Semiconductor Turnkey Service
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics
Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
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ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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