IC Packaging Services

Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services.

50 results found See AllSend Email to All

ICsense

Belgium

ICsense offers mixed-signal IC design and ASIC supply services for the automotive/aerospace, industrial, consumer and medical markets. The company is ISO9001:2008 and ISO13485 certified with design HQ in Belgium and sales in Japan, U.S. and Germany.

Services

ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety

View vendor page

Cactus Semiconductor

USA

Cactus Semiconductor is a full-service provider of low-power mixed-signal ASICs specializing in miniaturized portable and implantable medical devices.

Services

Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)

View vendor page

ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

View vendor page

Faraday Technology Corporation

Taiwan

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Services

Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services

IP Cores

USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield

View vendor page

JVD Analog ASIC Semiconductors

USA

JVD has been supplying Analog ASICs to the Medical, Automotive, Aerospace, Industrial, Power Management & Consumer Markets since 1982.

Services

Lower Your Product Costs, Reduce the Size of your Existing Design, Protect Your Intellectual Property, Protect Yourself from Product Obsolescence, No Minimum Volume or Financial Restrictions, Free NRE and Tooling

View vendor page

MAK

Sweden

MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.

Services

Microelectronic Assembly, Encapsulation and potting, Engineering Services

View vendor page

Tekmos

USA

Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

View vendor page

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

Services

Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing

View vendor page

UMC

Taiwan

UMC is a world-leading semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry.

Services

Advanced Technology 40nm, 28nm, Advanced Technology 90nm, 65nm/55nm, Mature Nodes, Speciality Technology MS/RF, NVM, HV, Test Services/Package Solution

View vendor page

BlackPepper Technologies

BlackPepper Technologies provides High-end value added technology services offering Spec to Silicon, Silicon to System Design, differentiated product & engineering capabilities for global semiconductor companies

View vendor page

SEMPAC

USA

SEMPAC is devoted to the design, development and manufacturing of Pre-molded “Open-Cavity” Plastic Packages.

Services

SEMPAC Open-Pak™ Products

View vendor page

Bayside Design Inc

USA

BDI provides the most comprehensive high-speed engineering design, modeling, analysis, measurement, characterization and verification services and solutions.

Services

Package Design, Lab Measurement

View vendor page

PandA Europe

UK

PandA Europe is an independent Technical and Market consultancy providing expertise in Semiconductor manufacturing Packaging, Assembly and Electronics interconnect technologies.

View vendor page

PREMA Semiconductor

Germany

PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.

View vendor page

HANA Micron

Korea

Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.

View vendor page

SigIntegrity Solutions

India

SigIntegrity provides design services related to IC package co-design, ASIC co-design, System Signal integrity, Power integrity analysis & Electromagnetic modeling of silicon & package interconnects.

Services

IC Package design, ASIC co-design, Signal Integrity & Power Integrity, Electromagnetic modeling

View vendor page

ISE Labs

ISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.

View vendor page

Cicor

Cicor is a globally active group of leading companies in the microelectronics industry. The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, hybrids and electronic modules.

View vendor page

WiWoTech

WiWoTech is a design and development company focused in IC package, silicon validation, wireless system and Smart Antenna design

View vendor page

Rockwood Wafer Reclaim

France

Rockwood offers wafer services such as: wafer surface processing, thinning, dicing, bonding, cleaning and handling substrates.

View vendor page