Monthly Archives: March 2018


Mobile Semiconductor Introduces 28nm Memory Compiler Support

Mobile Semiconductor today announced the introduction of its new 28nm memory compilers available immediately. Mobile Semiconductor’s silicon-proven embedded memory technology offers nine 28SLP GLOBALFOUNDRIES foundry sponsored compilers reaching all the way down to a 0.8V nominal power supply. Mobile Semiconductor also works with other top tier foundries delivering industry leading 28nm HPC+ memory solutions. These compilers are proven to be ideal for IoT and low power DSP applications.


These solutions are available in a range of architectures that include:

  • Low Voltage, Low Leakage, Low Power Family (LV)
  • Ultra Low Leakage, Low Power SRAM (ULL) Single Supply 0.8v Nominal
  • Ultra High Speed SRAM (UHS) up to 1.5GHz


Using voltage level translations, integrated power switches and Mobile Semiconductor’s proprietary ultra low leakage retention mode, the 28nm HPC+ compilers utilizes the high density ULL bit cell to give the end users the ideal solutions for low power applications.


“Building upon our success in a series of industry leading memory compilers,” Founder and CEO Cameron Fisher said, “we are confident that our new 28nm compliers will enable a wide range of new designs in the exploding IoT market space.”


Fisher continued, “Mobile Semiconductor is the leader in providing low power solutions and the low power compilers supports a deep sleep mode that allows many years of operation on a simple button cell battery.”


For more information please contact Mobile Semiconductor at


About Mobile Semiconductor:

Mobile Semiconductor is located in Seattle, Washington with a design center in Williston, Vermont. The company develops SRAM, ROM and Register File compilers optimized for applications requiring ultra-low power, low leakage or ultra-high performance.

Mobile Semiconductor’s customers differentiate their products by using our application-optimized SRAMs to meet their high performance and ultra-low power product requirements.

growth market

IC Insights Raises 2018 IC Market Forecast from 8% to 15%

The biggest adjustments to the original MR18 IC market forecasts were to the memory market; specifically the DRAM and NAND flash segments.  The DRAM and NAND flash memory market growth forecasts for 2018 have been adjusted upward to 37% for DRAM (13% shown in MR18) and 17% for NAND flash (10% shown in MR18).


The big increase in the DRAM market forecast for 2018 is primarily due to a much stronger ASP expected for this year than was originally forecast.  IC Insights now forecasts that the DRAM ASP will register a 36% jump in 2018 as compared to 2017, when the DRAM ASP surged by an amazing 81%.  Moreover, the NAND flash ASP is forecast to increase 10% this year, after jumping by 45% in 2017.  In contrast to strong DRAM and NAND flash ASP increases, 2018 unit volume growth for these product segments is expected to be up only 1% and 6%, respectively.


At $99.6 billion, the DRAM market is forecast to be by far the largest single product category in the IC industry in 2018, exceeding the expected NAND flash market ($62.1 billion) by $37.5 billion.  Figure 1 shows that the DRAM market has provided a significant tailwind or headwind for total worldwide IC market growth in four out of the last five years.


The DRAM market dropped by 8% in 2016, spurred by a 12% decline in ASP, and the DRAM segment became a headwind to worldwide IC market growth that year instead of the tailwind it had been in 2013 and 2014.  As shown, the DRAM market shaved two percentage points off of total IC industry growth in 2016.  In contrast, the DRAM segment boosted total IC market growth last year by nine percentage points. For 2018, the expected five point positive impact of the DRAM market on total IC market growth is forecast to be much less significant than it was in 2017.



Figure 1



To review additional information about IC Insights’ new and existing market research reports and services please visit our website:


Presto Engineering offers specialised testing service for CMOS Image Sensors

esting CMOS image sensors on a wafer-size scale is not easy because of the challenges of creating uniform illumination over a large area. Presto Engineering has developed a custom, computer-controlled solution that illuminates sections of the wafer in turn. Integrating the results enables the whole wafer to be tested automatically for an array of large sensors or even sensors that are right up to the size of an entire 12-inch wafer.


“An entire wafer can be tested in a laboratory using a similar method,” explained Martin Kingdon, Presto Engineering’s VP of Sales. “However laboratories are not geared up for fast commercial testing so we designed our own solution to test any size wafer. Importantly, we can do this in small to medium sized test runs here in Europe at our Class 10K cleanroom facility in Meyreuil, France, near Aix-en-Provence. We believe that we are probably the only such commercial test service to be available in Europe.”


Commercial testing of small image sensors is very easy as the small areas involved are easy to illuminate with a controlled, uniform test pattern of light. But, as the area increases, it becomes harder to maintain the uniformity across the test area of an individual sensor due to the limitation of the optics. By illuminating sections of the wafer in turn, Presto is able to merge the results together to test the functionality of the image sensors on the wafer.


The need for larger image sensors is being driven, in particular, by medical imaging and aerospace that can require whole wafer-sized, image sensors and are transitioning from CCD to CMOS solutions. Similarly, security and military applications, etc. are all wanting larger, better sensors to provide the resolution required to provide clear sharp images, as well as other 4K resolution cameras. The tester is located in Presto’s EAL 5/6+ facilities so that it meets the security needs of sensitive applications.


Presto’s Teradyne® IP750Ex based test solution provides a large (80x100mm), uniform (+/-2%), high-intensity illumination field up to 10K Lux at a range of colour temperatures. Built-in IR filtering prevents sensor damage. Its ability create a customised test solution for complex devices (as large as 32M pixels at speeds up to 200MHz) on up to 12-inch wafers enables fast ramps without compromising cost-of-test.


Presto Engineering will be attending the conference at Image Sensors Europe 2018 on the 14th and 15th March 2018.


More information about Presto Engineering can be found at


About Presto Engineering

Presto Engineering provides outsourced operations for semiconductor, sensor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market. The company is a recognized expert in the development of industrial solutions for RF, analog, mixed-signal, CMOS image sensing and secured applications – from tape-out to delivery of finished goods. Presto’s proprietary, highly secure manufacturing and provisioning solution, coupled with extensive back-end expertise, gives its customers a competitive advantage. The company offers a global, flexible, dedicated network with operations across Europe, the USA and Asia. For more information, visit: or email



Agency Contact USA:  
Sandy Fewkes, MindWrite Communications, Inc.
T : +1 408 224 4024
Agency Contact Europe & ROW:
Nigel Robson, Vortex PR
T: +44 1481 233080

CSEM has selected ID-Xplore™ to accelerate its analog design process

ID-Xplore™ was developed to give analog designers accurate, deterministic and correct-by-construction transistor sizing and design capabilities. “New technologies developed for ID-Xplore™ increase the designer’s ability to visualize performance sensitivity and understand the impact of design space tuning” explains Dr. Ramy Iskander, CEO of Intento Design. “CSEM’s decision to partner with us confirms the potential of our solution, as the Swiss R&D company is among the world leaders in the design of integrated circuits”.


We have been impressed by the speed and efficiency of ID-Xplore™ to capture designer intentions and to quickly explore a set of design solutions” says Alain-Serge Porret, VP Integrated and Wireless Systems, at CSEM. ”We appreciate the novel incremental design approach of ID-Xplore™, the facilitation of IP reuse and knowledge transfer between engineers to enable sharing of circuit design insights”.


ID-Xplore™ uses the OpenAccess database standard and is fully integrated within the Cadence design environment. The designer’s implicit & explicit knowledge is expressed as technology independent constraints. ID-Xplore™ enables seamless porting between technologies, and is fully compatible with the latest commercially available process design kits.


Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power saving, enhanced performance and lower system cost to meet the specific AI requirement.



Faraday’s FPGA-to-ASIC conversion service, in conjunction with comprehensive IP solutions of PCIe Gen 3/4, MIPI D-PHY, DDR3/4 and SerDes 12/16/25/28/56G at advance FinFET process nodes, are particularly suited for AI chips requiring higher bandwidth and a lower latency interface. From cloud to edge computing, in applications like machine vision, NLP, and sentiment analysis, Faraday can deliver optimized ASIC chip designs featuring 30~100 times better energy efficiency.


With 25 years of IP development experience, Faraday has the ability to customize IPs for ASIC cost efficiency in mass production. Faraday has handcrafted SRAM macros allowing for a reduction of on-chip SRAM area by 5~50%, in addition, its SRAM Redundancy & Repair design feature increases yield rates by up to 10%.


“As AI algorithm mature and the market demand for AI products rise, customers look to replace FPGA chips with ASIC devices for a competitive system BOM cost. Faraday’s ASIC service has been validated in thousands of designs and shipped hundred millions of market proven SoCs. The service provides AI customers with a path to lower integration risk and cost, accelerating the adoption of new DNN algorithms”, said Flash Lin, COO of Faraday Technology.


Press Contact
Evan Ke
886.3.5787888 ext. 8689


Want to learn more about Faraday Technology, check our this page.


Mnano selects Dolphin Integration’s six-channel Audio converter for its next generation of Smart Speakers

According to PR Newswire, being fueled by the rising demand for voice enabled devices, the global smart speaker market is likely to grow at a CAGR of 43.68% in terms of unit shipment during 2016–2022.


Early innovators as well as market leaders of these newly marketed products are demanding extremely high standards of sound quality, with minimum noise along with a complex combination of 4 to 8 channel ADC for spatial beamforming applications. Fabless provider and market leader Mnano, has chosen Dolphin Integration for its innovative generation of multi-channel audio A/D Converter, YANZI-A-hexADC-VD.01, which combines an embedded Voice Activity Detector with a complete set of audio features.


In Wireless applications such as Smart speakers, SoC architects must deal with the complicated issue of power consumption.  A standard practice is to maintain the audio components in active mode, listening for voice almost 95% of the time, thus reducing precious battery lifetime.


Dolphin Integration’s patented Voice Activity Detector, WhisperTriggerTM, when embedded in the audio converter consumes a mere 25 µA in the Always-On. This is a resounding success in achieving negligible power consumption.


The combination of a high dynamic range of 100 dB, together with an embedded linear regulator, ensures the best far field voice recognition and resilience against noise caused by audio, master clocks or by the power supply.


“Meeting the right balance between silicon costs, audio quality and low power consumption is a challenging task” stated Mr. Guoxin ZHANG, Dean at Mnano. “The YANZI-A-hexADC-VD.01, a feature-rich audio ADC from Dolphin Integration, packs all these advantages into our smart speaker offering”.


In a voice-enabled device apart from high power consumption, the number of channels adds challenges on channel synchronization. Indeed, most of the speech recognition solutions use advanced algorithms such as beam-forming and echo cancelation and they may be sensitive to the phase mismatch between the channels, resulting in degradation of the performance of the algorithm. Thanks to the phase alignment feature, fabless companies can be rest assured of an exceptional sound quality for end users.


“We are highly confident that the combination of Dolphin Integration’s Multi-channel A/D Converter and Mnano’s expertise in system design will result in advanced SoCs capable of meeting the stringent demands of the next generation of Wireless Smart Speakers” said Frederic Renoux, Executive VP Marketing and Sales at Dolphin Integration.


We continuously strive to help companies like Mnano benefit from truly cost-effective silicon IPs which can meet the performance requirements of new generation audio devices.



About Mnano

Shenzhen Micro-nano, Integrated Circuit and System Application Research Institute, was established in February 2013, in Shenzhen. It has received the strong support of Shenzhen’s semiconductor backbone enterprises, a key technical industrialization platform for the close cooperation between government, industry, universities and research institutes. It has actively developed key cutting-edge technologies in the field of integrated circuits and perceptual computing and profound technical accumulation in areas such as voice perception and machine vision perception. Since 2016, the Micro and Nano Institute has collaborated with the National IC Designing Industrial Base in Shenzhen to undertake the national core fire platform and support the innovation and entrepreneurship ecosystem of integrated circuits.



About Dolphin Integration

Dolphin Integration is a pioneer in “enabling low-power Systems-on-Chip” for worldwide customers including all the major actors of the semiconductor industry – with a unique offering of high-density Foundation, Feature and SoC Fabric of Silicon IP components best suited for low power-consumption.

Over 30 years of experience in the integration of silicon IP components with complementary EDA solutions for a power-integrity driven approach to design, providing ASIC/SoC design and fabrication, have made Dolphin Integration a true one-stop shop for all customer needs.

It is not just one more supplier of Technology, but also the provider of the Dolphin Integration know-how!



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