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Silicon Wafer Integrated Fan-out Technology Packaging for Highly Integrated Products

January 16, 2017, anysilicon

The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in

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X-Fab, SMIC, and TowerJazz each grew by ≥30% in 2016

January 12, 2017, anysilicon

The pure-play semiconductor foundry market is forecast to play an increasingly stronger role in the worldwide IC market during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available later this month.  The 20th anniversary edition of The McClean Report forecasts that the 2016-2021 pure-play

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Fabless Silicon Manufacture: Supplier Relationships Matter

January 09, 2017, anysilicon

When someone contributes to the success of your product, but they don’t work directly for your company, why should they work as hard as your employees ? Your employees, and to a smaller extent your suppliers, obviously have a financial interest in your company’s success. But success takes more than

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