How to bulletproof your ASIC Design

February 11, 2016, anysilicon

As the ASIC design is moving towards maskset creation and tapeout, the cost of design changes are increasing exponentially.  It’s easier and cheaper to modify the ASIC design and even redo some of the chip architecture early the design stage. However it’s much more difficult and far more expensive after

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Apple And Samsung Top Semiconductor Customers Again In 2015

February 08, 2016, anysilicon

The top semiconductor buyers of 2015 where once again Apple and Samsung Electronics. According to Gartner, the leading information technology, marketing research and advisory firm in America, Apple and Samsung accounted for 17.7% of the market. Together the two consumed a total of 59 billion dollars of semiconductors for the

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2 Easy Steps to Find Semiconductor Packaging

February 05, 2016, anysilicon

Semiconductor Packaging has become a critical factor to any semiconductor company success. Engineers have to select a semiconductor package effectively to both meet demanding price pressure but also system level performance requirements and size limitations.
Furthermore, with today’s price pressures – companies are spending more time in finding, selecting,

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Understanding Antenna in Package Design

February 03, 2016, anysilicon

Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete

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TowerJazz Completes Acquisition of Maxim’s Fab

February 02, 2016, anysilicon

TowerJazz, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc. (NASDAQ:MXIM). This acquisition will expand TowerJazz’s current worldwide manufacturing capacity, cost-effectively increasing its production by about 28,000 wafers per month. The availability of

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Qualcomm lays off employees in Israel

February 01, 2016, anysilicon

According to sources, chipmaker Qualcomm is laying off today a few dozen of employees in the company’s development center in Israel. The layoffs are part of a worldwide cutback of 15% of its total work force that was announced by the company in July 2015 to help the company save

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