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Services
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Services
ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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IP Cores
Microcontrollers and Processors, Video and Image Compression, Data Compression, Interconnects and Interfaces , Peripherals and Controllers , Security
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Services
PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Services
IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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IP Cores
DisplayPort 1.4a Transmitter, DisplayPort 1.4a Receiver, Display Stream Compression (DSC 1.2a) Encoder, Display Stream Compression (DSC 1.2a) Decoder
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Services
RTL2GDS2, Functional Verification, Frontend Design, Backend Design, Embedded Systems Design
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IP Cores
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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IP Cores
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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IP Cores
Low Voltage ESD/EOS protection (up to 5V), HV/BCD EOS/ESD protection (5V and higher), LIN PHY (transceiver) , Programmable Clipping Circuit for Antenna pins, Power-on-Reset Circuit, Radiation Hard, ESD robust Level Shifters
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Services
Circuit Design, Product Development, Memory products, IP and consulting, Test Consulting
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Services
Mixed-Signal ASIC Designs Portfolio, ASIC Design, ASIC Testing, Products, Comport Data, Comport Data Contact Form
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Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
Foundry Services, Custom Foundry Services, Full Turnkey, In House Assembly and Test Development, In-house Qualification and Failure Analysis Services, In House SiP: System in Package, Foundry Process Longevity
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IP Cores
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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Services
Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design, Full Custom ASIC Design
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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